High density interconnectPCB

Gain the ability to strategically connect only certain pads on certain layers, which greatly reduces the need for board real estate.

If you'd like to learn more about HDI read our blog post on high density interconnect (HDI) and ultra HDI PCB technologies.

High density interconnectcost

Gain the ability to strategically connect only certain pads on certain layers, which greatly reduces the need for board real estate.

HDI PCB manufacturer

Define the microvia structure and associated constraintsSpecific values for via capacitance and delay are important for constraint adherence (e.g. delay formulas) and simulation accuracy.

Many board designers are not communicating with their PCB fabricator early in the design process when implementing HDI in their design. Lack of communication or understanding of the technology leads to potential downstream issues.

ultra high-densityinterconnect

Via fanout routing schemesUnique via fanout routing schemes (define what depth to stagger to; router will create appropriate stagger pattern)

Route signal traces through very small component pin-pitch fields and through high component density areas of your board.

HDI PCB design Guide PDF

High-density interconnect is an advanced manufacturing technique that allows PCB designers to implement a high number of interconnects in a minimal amount of space. It allows you to condense things on a board and overall make it smaller.

Localized rules under components to facilitate escape pathsWhen doing the fanout, localized rules (trace widths/clearances, via sizes) can be defined to achieve the densities necessary to route away from the high-density pins. Using larger rules everywhere else will result in higher yield.

By utilizing HDI, you increase your ability to have a much greater density in a smaller footprint and it enables you to rout signal traces through very small component pin-pitch fields and through high component density areas of your board. With HDI, you gain the ability to strategically connect only certain pads on certain layers, which greatly reduces the need for board real estate which is important as electronics continue to get smaller and smaller.

Route signal traces through very small component pin-pitch fields and through high component density areas of your board.

Many I/Os in a small area makes it nearly impossible to route to the inner balls with normal PCB fabrication technology. What is required for these connections are layers of high-density interconnect (HDI) with microvias. This technology merges IC fabrication with PCB manufacturing.