liquid cooler with lcd screen free sample

The complete list of commands and options can be found in liquidctl --help and in the man page, but the following topics cover the most common operations.

Brackets [ ], parenthesis ( ), less than/greater than < > and ellipsis ... are used to describe, respectively, optional, required, positional and repeating elements. Example commands are prefixed with a number sign #, which also serves to indicate that on Linux root permissions (or suitable udev rules) may be required.

The --verbose option will print some extra information, like automatically made adjustments to user-provided settings. And if there is a problem, the --debug flag will make liquidctl output more information to help identify its cause; be sure to include this when opening a new issue.

Note: in addition to --debug, setting the PYUSB_DEBUG=debug and LIBUSB_DEBUG=4 environment variables can be helpful with problems suspected to relate to PyUSB or LibUSB.

In case more than one supported device is found, one them can be selected with --match , where matches part of the desired device"s description using a case insensitive comparison.

Most devices provide some status information, like fan speeds and liquid temperatures. This can be queried for all devices or using the filtering methods mentioned before.

Fan and pump speeds can be set to fixed values or, if the device supports them, custom profiles. The specific documentation for each device will list the available modes, as well as which sensor is used for custom profiles. In general, liquid coolers only support custom profiles that are based on the internal liquid temperature probe.

Color arguments containing spaces, parenthesis or commas need to be quoted, as these characters can have special meaning on the command-line; the easiest way to do this on all supported platforms is with double quotes.

On systems running Linux and systemd a service unit can be used to configure liquidctl devices. A simple example is provided bellow, which you can edit to match your preferences. Save it to /etc/systemd/system/liquidcfg.service.

The configuration of devices can be automated by writing a batch file and setting up a new task for (every) login using Windows Task Scheduler. The batch file can be really simple and only needs to contain the invocations of liquidctl that would otherwise be done manually.

Make sure that liquidctl is available in the context where the batch file will run: in short, liquidctl --version should work within a normal Command Prompt window.

A slightly more complex example can be seen in issue #14 ("Can I autostart liquidctl on Windows?"), that uses the LEDs to convey progress or eventual errors. Chris" guide on Replacing NZXT’s CAM software on Windows for Kraken is also a good read.

This can be temporarily solved by manually rebinding the device to the kernel usbhid driver. Replace and with the correct values from lsusb -vt (also assumes there is only HID interface, adjust if necessary):

Alternatively to running liquidctl as root (or with sudo), you can install the udev rules provided in extra/linux/71-liquidctl.rules to allow unprivileged access to the devices supported by liquidctl.

Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives.

Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling. Use of heatsinks cooled by airflow reduces the temperature rise produced by a given amount of heat. Attention to patterns of airflow can prevent the development of hotspots. Computer fans are widely used along with heatsink fans to reduce temperature by actively exhausting hot air. There are also more exotic cooling techniques, such as liquid cooling. All modern day processors are designed to cut out or reduce their voltage or clock speed if the internal temperature of the processor exceeds a specified limit. This is generally known as Thermal Throttling, in the case of reduction of clock speeds or Thermal Shutdown in the case of a complete shutdown of the device or system.

Cooling may be designed to reduce the ambient temperature within the case of a computer, such as by exhausting hot air, or to cool a single component or small area (spot cooling). Components commonly individually cooled include the CPU, graphics processing unit (GPU) and the northbridge.

Poor airflow including turbulence due to friction against impeding components such as ribbon cables, or incorrect orientation of fans, can reduce the amount of air flowing through a case and even create localized whirlpools of hot air in the case. In some cases of equipment with bad thermal design, cooling air can easily flow out through "cooling" holes before passing over hot components; cooling in such cases can often be improved by blocking of selected holes.

Because high temperatures can significantly reduce life span or cause permanent damage to components, and the heat output of components can sometimes exceed the computer"s cooling capacity, manufacturers often take additional precautions to ensure that temperatures remain within safe limits. A computer with thermal sensors integrated in the CPU, motherboard, chipset, or GPU can shut itself down when high temperatures are detected to prevent permanent damage, although this may not completely guarantee long-term safe operation. Before an overheating component reaches this point, it may be "throttled" until temperatures fall below a safe point using dynamic frequency scaling technology. Throttling reduces the operating frequency and voltage of an integrated circuit or disables non-essential features of the chip to reduce heat output, often at the cost of slightly or significantly reduced performance. For desktop and notebook computers, throttling is often controlled at the BIOS level. Throttling is also commonly used to manage temperatures in smartphones and tablets, where components are packed tightly together with little to no active cooling, and with additional heat transferred from the hand of the user.

The user can also do a lot in order to preemptively prevent damage from happening. They can perform a visual inspection of the cooler and case fans. If any of them aren"t spinning correctly, it"s likely that they"ll need to be replaced. The user should also clean the fans thoroughly, since dust and debris can increase the ambient case temperature and impact fan performance. The best way to do so is with compressed air in an open space. Another preemptive technique to prevent damage is to replace the thermal paste regularly.

As electronic computers became larger and more complex, cooling of the active components became a critical factor for reliable operation. Early vacuum-tube computers, with relatively large cabinets, could rely on natural or forced air circulation for cooling. However, solid-state devices were packed much more densely and had lower allowable operating temperatures.

Starting in 1965, IBM and other manufacturers of mainframe computers sponsored intensive research into the physics of cooling densely packed integrated circuits. Many air and liquid cooling systems were devised and investigated, using methods such as natural and forced convection, direct air impingement, direct liquid immersion and forced convection, pool boiling, falling films, flow boiling, and liquid jet impingement. Mathematical analysis was used to predict temperature rises of components for each possible cooling system geometry.

IBM developed three generations of the Thermal Conduction Module (TCM) which used a water-cooled cold plate in direct thermal contact with integrated circuit packages. Each package had a thermally conductive pin pressed onto it, and helium gas surrounded chips and heat-conducting pins. The design could remove up to 27 watts from a chip and up to 2000 watts per module, while maintaining chip package temperatures of around 50 °C (122 °F). Systems using TCMs were the 3081 family (1980), ES/3090 (1984) and some models of the ES/9000 (1990).

Heat removal was critical. Refrigerant was circulated through piping embedded in vertical cooling bars in twelve columnar sections of the machine. Each of the 1662 printed circuit modules of the machine had a copper core and was clamped to the cooling bar. The system was designed to maintain the cases of integrated circuits at no more than 54 °C (129 °F), with refrigerant circulating at 21 °C (70 °F). Final heat rejection was through a water-cooled condenser.

In the later Cray-2, with its more densely packed modules, Seymour Cray had trouble effectively cooling the machine using the metal conduction technique with mechanical refrigeration, so he switched to "liquid immersion" cooling. This method involved filling the chassis of the Cray-2 with a liquid called Fluorinert. Fluorinert, as its name implies, is an inert liquid that does not interfere with the operation of electronic components. As the components came to operating temperature, the heat would dissipate into the Fluorinert, which was pumped out of the machine to a chilled water heat exchanger.

Performance per watt of modern systems has greatly improved; many more computations can be carried out with a given power consumption than was possible with the integrated circuits of the 1980s and 1990s. Recent supercomputer projects such as Blue Gene rely on air cooling, which reduces cost, complexity, and size of systems compared to liquid cooling.

A computer has a certain resistance to air flowing through the chassis and components. This is the sum of all the smaller impediments to air flow, such as the inlet and outlet openings, air filters, internal chassis, and electronic components. Fans are simple air pumps that provide pressure to the air of the inlet side relative to the output side. That pressure difference moves air through the chassis, with air flowing to areas of lower pressure.

Fans generally have two published specifications: free air flow and maximum differential pressure. Free air flow is the amount of air a fan will move with zero back-pressure. Maximum differential pressure is the amount of pressure a fan can generate when completely blocked. In between these two extremes are a series of corresponding measurements of flow versus pressure which is usually presented as a graph. Each fan model will have a unique curve, like the dashed curves in the adjacent illustration.

Fans can be installed parallel to each other, in series, or a combination of both. Parallel installation would be fans mounted side by side. Series installation would be a second fan in line with another fan such as an inlet fan and an exhaust fan. To simplify the discussion, it is assumed the fans are the same model.

Parallel fans will provide double the free air flow but no additional driving pressure. Series installation, on the other hand, will double the available static pressure but not increase the free air flow rate. The adjacent illustration shows a single fan versus two fans in parallel with a maximum pressure of 0.15 inches (3.8 mm) of water and a doubled flow rate of about 72 cubic feet per minute (2.0 m3/min).

To determine flow rate through a chassis, the chassis impedance curve can be measured by imposing an arbitrary pressure at the inlet to the chassis and measuring the flow through the chassis. This requires fairly sophisticated equipment. With the chassis impedance curve (represented by the solid red and black lines on the adjacent curve) determined, the actual flow through the chassis as generated by a particular fan configuration is graphically shown where the chassis impedance curve crosses the fan curve. The slope of the chassis impedance curve is a square root function, where doubling the flow rate required four times the differential pressure.

In this particular example, adding a second fan provided marginal improvement with the flow for both configurations being approximately 27–28 cubic feet per minute (0.76–0.79 m3/min). While not shown on the plot, a second fan in series would provide slightly better performance than the parallel installation.

For example, a typical chassis with 500 watts of load, 130 °F (54 °C) maximum internal temperature in a 100 °F (38 °C) environment, i.e. a difference of 30 °F (17 °C):

This would be actual flow through the chassis and not the free air rating of the fan. It should also be noted that "Q", the heat transferred, is a function of the heat transfer efficiency of a CPU or GPU cooler to the airflow.

Mainboard of a NeXTcube computer (1990) with 32 bit microprocessor Motorola 68040 operated at 25 MHz. At the lower edge of the image and left from the middle, the heat sink mounted directly on the CPU can be seen. There was no dedicated fan for the CPU. The only other IC with a heat sink is the RAMDAC (right from CPU).

Passive heatsink cooling involves attaching a block of machined or extruded metal to the part that needs cooling. A thermal adhesive may be used. More commonly for a personal computer CPU, a clamp holds the heatsink directly over the chip, with a thermal grease or thermal pad spread between. This block has fins and ridges to increase its surface area. The heat conductivity of metal is much better than that of air, and it radiates heat better than the component that it is protecting (usually an integrated circuit or CPU). Fan-cooled aluminium heatsinks were originally the norm for desktop computers, but nowadays many heatsinks feature copper base-plates or are entirely made of copper.

Dust buildup between the metal fins of a heatsink gradually reduces efficiency, but can be countered with a gas duster by blowing away the dust along with any other unwanted excess material.

Usually a heatsink is attached to the integrated heat spreader (IHS), essentially a large, flat plate attached to the CPU, with conduction paste layered between. This dissipates or spreads the heat locally. Unlike a heatsink, a spreader is meant to redistribute heat, not to remove it. In addition, the IHS protects the fragile CPU.

Another growing trend due to the increasing heat density of computers, GPUs, FPGAs, and ASICs is to immerse the entire computer or select components in a thermally, but not electrically, conductive liquid. Although rarely used for the cooling of personal computers,transformers. It is also becoming popular with data centers.passive heat exchange between the computer hardware and the enclosure it is placed in.heater core or radiator) might still be needed though, and the piping also needs to be placed correctly.

The coolant used must have sufficiently low electrical conductivity not to interfere with the normal operation of the computer. If the liquid is somewhat electrically conductive, it may cause electrical shorts between components or traces and permanently damage them.dielectric) and not conduct electricity.

A wide variety of liquids exist for this purpose, including transformer oils, synthetic single-phase and dual phase dielectric coolants such as 3M Fluorinert or 3M Novec. Non-purpose oils, including cooking, motor and silicone oils, have been successfully used for cooling personal computers.

Where powerful computers with many features are not required, less powerful computers or ones with fewer features can be used. As of 2011VIA EPIA motherboard with CPU typically dissipates approximately 25 watts of heat, whereas a more capable Pentium 4 motherboard and CPU typically dissipates around 140 watts. Computers can be powered with direct current from an external power supply unit which does not generate heat inside the computer case. The replacement of cathode ray tube (CRT) displays by more efficient thin-screen liquid crystal display (LCD) ones in the early twenty-first century has reduced power consumption significantly.

A component may be fitted in good thermal contact with a heatsink, a passive device with large thermal capacity and with a large surface area relative to its volume. Heatsinks are usually made of a metal with high thermal conductivity such as aluminium or copper,thermal grease, a thermal pad, or thermal adhesive may be placed between the component and heatsink.

Heat is removed from the heatsink by convection, to some extent by radiation, and possibly by conduction if the heatsink is in thermal contact with, say, the metal case. Inexpensive fan-cooled aluminium heatsinks are often used on standard desktop computers. Heatsinks with copper base-plates, or made of copper, have better thermal characteristics than those made of aluminium. A copper heatsink is more effective than an aluminium unit of the same size, which is relevant with regard to the high-power-consumption components used in high-performance computers.

Passive heatsinks are commonly found on older CPUs, parts that do not dissipate much power (such as the chipset), computers with low-power processors, and equipment where silent operation is critical and fan noise unacceptable.

Several brands of DDR2, DDR3, DDR4 and DDR5 DRAM memory modules are fitted with a finned heatsink clipped onto the top edge of the module. The same technique is used for video cards that use a finned passive heatsink on the GPU.

Dust tends to build up in the crevices of finned heatsinks, particularly with the high airflow produced by fans. This keeps the air away from the hot component, reducing cooling effectiveness; however, removing the dust restores effectiveness.

Peltier junctions are generally only around 10-15% as efficient as the ideal refrigerator (Carnot cycle), compared with 40–60% achieved by conventional compression cycle systems (reverse Rankine systems using compression/expansion).moving parts, low maintenance, compact size, and orientation insensitivity) outweighs pure efficiency.

As active heat pumps which consume power, TECs can produce temperatures below ambient, impossible with passive heatsinks, radiator-cooled liquid cooling, and heatpipe HSFs. However, while pumping heat, a Peltier module will typically consume more electric power than the heat amount being pumped.

Liquid cooling is a highly effective method of removing excess heat, with the most common heat transfer fluid in desktop PCs being (distilled) water. The advantages of water cooling over air cooling include water"s higher specific heat capacity and thermal conductivity.

The principle used in a typical (active) liquid cooling system for computers is identical to that used in an automobile"s internal combustion engine, with the water being circulated by a water pump through a water block mounted on the CPU (and sometimes additional components as GPU and northbridge)heat exchanger, typically a radiator. The radiator is itself usually cooled additionally by means of a fan.

Liquids allow the transfer of more heat from the parts being cooled than air, making liquid cooling suitable for overclocking and high performance computer applications.

Disadvantages of liquid cooling include complexity and the potential for a coolant leak. Leaking water (and any additives in the water) can damage electronic components with which it comes into contact, and the need to test for and repair leaks makes for more complex and less reliable installations. (The first major foray into the field of liquid-cooled personal computers for general use, the high-end versions of Apple"s Power Mac G5, was ultimately doomed by a propensity for coolant leaks.

While originally limited to mainframe computers, liquid cooling has become a practice largely associated with overclocking in the form of either manufactured all-in-one (AIO) kits or do-it-yourself setups assembled from individually gathered parts.

A heat pipe is a hollow tube containing a heat transfer liquid. The liquid absorbs heat and evaporates at one end of the pipe. The vapor travels to the other (cooler) end of the tube, where it condenses, giving up its latent heat. The liquid returns to the hot end of the tube by gravity or capillary action and repeats the cycle. Heat pipes have a much higher effective thermal conductivity than solid materials. For use in computers, the heatsink on the CPU is attached to a larger radiator heatsink. Both heatsinks are hollow, as is the attachment between them, creating one large heat pipe that transfers heat from the CPU to the radiator, which is then cooled using some conventional method. This method is usually used when space is tight, as in small form-factor PCs and laptops, or where no fan noise can be tolerated, as in audio production. Because of the efficiency of this method of cooling, many desktop CPUs and GPUs, as well as high end chipsets, use heat pipes or vapor chambers in addition to active fan-based cooling and passive heatsinks to remain within safe operating temperatures. A vapor chamber operates on the same principles as a heat pipe but takes on the form of a slab or sheet instead of a pipe. Heat pipes may be placed vertically on top and form part of vapor chambers. Vapor chambers may also be used on high-end smartphones.

The corona discharge cooler developed by Kronos works in the following manner: A high electric field is created at the tip of the cathode, which is placed on one side of the CPU. The high energy potential causes the oxygen and nitrogen molecules in the air to become ionized (positively charged) and create a corona (a halo of charged particles). Placing a grounded anode at the opposite end of the CPU causes the charged ions in the corona to accelerate towards the anode, colliding with neutral air molecules on the way. During these collisions, momentum is transferred from the ionized gas to the neutral air molecules, resulting in movement of gas towards the anode.

The advantages of the corona-based cooler are its lack of moving parts, thereby eliminating certain reliability issues and operating with a near-zero noise level and moderate energy consumption.

Undervolting is a practice of running the CPU or any other component with voltages below the device specifications. An undervolted component draws less power and thus produces less heat. The ability to do this varies by manufacturer, product line, and even different production runs of the same product (as well as that of other components in the system), but processors are often specified to use voltages higher than strictly necessary. This tolerance ensures that the processor will have a higher chance of performing correctly under sub-optimal conditions, such as a lower-quality motherboard or low power supply voltages. Below a certain limit, the processor will not function correctly, although undervolting too far does not typically lead to permanent hardware damage (unlike overvolting).

Conventional cooling techniques all attach their "cooling" component to the outside of the computer chip package. This "attaching" technique will always exhibit some thermal resistance, reducing its effectiveness. The heat can be more efficiently and quickly removed by directly cooling the local hot spots of the chip, within the package. At these locations, power dissipation of over 300 W/cm2 (typical CPU is less than 100 W/cm2) can occur, although future systems are expected to exceed 1000 W/cm2.

In micro-channel heatsinks, channels are fabricated into the silicon chip (CPU), and coolant is pumped through them. The channels are designed with very large surface area which results in large heat transfers. Heat dissipation of 3000 W/cm2 has been reported with this technique.heat flux is lower with dielectric coolants used in electronic cooling.

Phase-change cooling is an extremely effective way to cool the processor. A vapor compression phase-change cooler is a unit that usually sits underneath the PC, with a tube leading to the processor. Inside the unit is a compressor of the same type as in an air conditioner. The compressor compresses a gas (or mixture of gases) which comes from the evaporator (CPU cooler discussed below). Then, the very hot high-pressure vapor is pushed into the condenser (heat dissipation device) where it condenses from a hot gas into a liquid, typically subcooled at the exit of the condenser then the liquid is fed to an expansion device (restriction in the system) to cause a drop in pressure a vaporize the fluid (cause it to reach a pressure where it can boil at the desired temperature); the expansion device used can be a simple capillary tube to a more elaborate thermal expansion valve. The liquid evaporates (changing phase), absorbing the heat from the processor as it draws extra energy from its environment to accommodate this change (see latent heat). The evaporation can produce temperatures reaching around −15 to −150 °C (5 to −238 °F). The liquid flows into the evaporator cooling the CPU, turning into a vapor at low pressure. At the end of the evaporator this gas flows down to the compressor and the cycle begins over again. This way, the processor can be cooled to temperatures ranging from −15 to −150 °C (5 to −238 °F), depending on the load, wattage of the processor, the refrigeration system (see refrigeration) and the gas mixture used. This type of system suffers from a number of issues (cost, weight, size, vibration, maintenance, cost of electricity, noise, need for a specialized computer tower) but, mainly, one must be concerned with dew point and the proper insulation of all sub-ambient surfaces that must be done (the pipes will sweat, dripping water on sensitive electronics).

A "thermosiphon" traditionally refers to a closed system consisting of several pipes and/or chambers, with a larger chamber containing a small reservoir of liquid (often having a boiling point just above ambient temperature, but not necessarily). The larger chamber is as close to the heat source and designed to conduct as much heat from it into the liquid as possible, for example, a CPU cold plate with the chamber inside it filled with the liquid. One or more pipes extend upward into some sort of radiator or similar heat dissipation area, and this is all set up such that the CPU heats the reservoir and liquid it contains, which begins boiling, and the vapor travels up the tube(s) into the radiator/heat dissipation area, and then after condensing, drips back down into the reservoir, or runs down the sides of the tube. This requires no moving parts, and is somewhat similar to a heat pump, except that capillary action is not used, making it potentially better in some sense (perhaps most importantly, better in that it is much easier to build, and much more customizable for specific use cases and the flow of coolant/vapor can be arranged in a much wider variety of positions and distances, and have far greater thermal mass and maximum capacity compared to heat pipes which are limited by the amount of coolant present and the speed and flow rate of coolant that capillary action can achieve with the wicking used, often sintered copper powder on the walls of the tube, which have a limited flow rate and capacity.)

As liquid nitrogen boils at −196 °C (−320.8 °F), far below the freezing point of water, it is valuable as an extreme coolant for short overclocking sessions.

In a typical installation of liquid nitrogen cooling, a copper or aluminium pipe is mounted on top of the processor or graphics card. After the system has been heavily insulated against condensation, the liquid nitrogen is poured into the pipe, resulting in temperatures well below −100 °C (−148 °F).

Evaporation devices ranging from cut out heatsinks with pipes attached to custom milled copper containers are used to hold the nitrogen as well as to prevent large temperature changes. However, after the nitrogen evaporates, it has to be refilled. In the realm of personal computers, this method of cooling is seldom used in contexts other than overclocking trial-runs and record-setting attempts, as the CPU will usually expire within a relatively short period of time due to temperature stress caused by changes in internal temperature.

Although liquid nitrogen is non-flammable, it can condense oxygen directly from air. Mixtures of liquid oxygen and flammable materials can be dangerously explosive.

Liquid nitrogen cooling is, generally, only used for processor benchmarking, due to the fact that continuous usage may cause permanent damage to one or more parts of the computer and, if handled in a careless way, can even harm the user, causing frostbite.

Liquid helium, colder than liquid nitrogen, has also been used for cooling. Liquid helium boils at −269 °C (−452.20 °F), and temperatures ranging from −230 to −240 °C (−382.0 to −400.0 °F) have been measured from the heatsink.

The installation of higher performance, non-stock cooling may also be considered modding. Many overclockers simply buy more efficient, and often, more expensive fan and heatsink combinations, while others resort to more exotic ways of computer cooling, such as liquid cooling, Peltier effect heatpumps, heat pipe or phase change cooling.

Thermal compound is commonly used to enhance the thermal conductivity from the CPU, GPU, or any heat-producing components to the heatsink cooler. (Counterclockwise from top left: Arctic MX-2, Arctic MX-4, Tuniq TX-4, Antec Formula 7, Noctua NT-H1)

Most older PCs use flat ribbon cables to connect storage drives (IDE or SCSI). These large flat cables greatly impede airflow by causing drag and turbulence. Overclockers and modders often replace these with rounded cables, with the conductive wires bunched together tightly to reduce surface area. Theoretically, the parallel strands of conductors in a ribbon cable serve to reduce crosstalk (signal carrying conductors inducing signals in nearby conductors), but there is no empirical evidence of rounding cables reducing performance. This may be because the length of the cable is short enough so that the effect of crosstalk is negligible. Problems usually arise when the cable is not electromagnetically protected and the length is considerable, a more frequent occurrence with older network cables.

Supply cool air to the hot components as directly as possible. Examples are air snorkels and tunnels that feed outside air directly and exclusively to the CPU or GPU cooler. For example, the BTX case design prescribes a CPU air tunnel.

Expel warm air as directly as possible. Examples are: Conventional PC (ATX) power supplies blow the warm air out the back of the case. Many dual-slot graphics card designs blow the warm air through the cover of the adjacent slot. There are also some aftermarket coolers that do this. Some CPU cooling designs blow the warm air directly towards the back of the case, where it can be ejected by a case fan.

Air that has already been used to spot-cool a component should not be reused to spot-cool a different component (this follows from the previous items). The BTX case design violates this rule, since it uses the CPU cooler"s exhaust to cool the chipset and often the graphics card. One may come across old or ultra-low-budget ATX cases which feature a PSU mount in the top. Most modern ATX cases do however have a PSU mount in the bottom of the case with a filtered air vent directly beneath the PSU.

Fewer fans but strategically placed will improve the airflow internally within the PC and thus lower the overall internal case temperature in relation to ambient conditions. The use of larger fans also improves efficiency and lowers the amount of waste heat along with the amount of noise generated by the fans while in operation.

There is little agreement on the effectiveness of different fan placement configurations, and little in the way of systematic testing has been done. For a rectangular PC (ATX) case, a fan in the front with a fan in the rear and one in the top has been found to be a suitable configuration. However, AMD"s (somewhat outdated) system cooling guidelines notes that "A front cooling fan does not seem to be essential. In fact, in some extreme situations, testing showed these fans to be recirculating hot air rather than introducing cool air."

Loosely speaking, positive pressure means intake into the case is stronger than exhaust from the case. This configuration results in pressure inside of the case being higher than in its environment. Negative pressure means exhaust is stronger than intake. This results in internal air pressure being lower than in the environment. Both configurations have benefits and drawbacks, with positive pressure being the more popular of the two configurations. Negative pressure results in the case pulling air through holes and vents separate from the fans, as the internal gases will attempt to reach an equilibrium pressure with the environment. Consequently, this results in dust entering the computer in all locations. Positive pressure in combination with filtered intake solves this issue, as air will only incline to be exhausted through these holes and vents in order to reach an equilibrium with its environment. Dust is then unable to enter the case except through the intake fans, which need to possess dust filters.

Desktop computers typically use one or more fans for cooling. While almost all desktop power supplies have at least one built-in fan, power supplies should never draw heated air from within the case, as this results in higher PSU operating temperatures which decrease the PSU"s energy efficiency, reliability and overall ability to provide a steady supply of power to the computer"s internal components. For this reason, all modern ATX cases (with some exceptions found in ultra-low-budget cases) feature a power supply mount in the bottom, with a dedicated PSU air intake (often with its own filter) beneath the mounting location, allowing the PSU to draw cool air from beneath the case.

Each server can have an independent internal cooler system; Server cooling fans in (1 U) enclosures are usually located in the middle of the enclosure, between the hard drives at the front and passive CPU heatsinks at the rear. Larger (higher) enclosures also have exhaust fans, and from approximately 4U they may have active heatsinks. Power supplies generally have their own rear-facing exhaust fans.

Rack cabinet is a typical enclosure for horizontally mounted servers. Air typically drawn in at the front of the rack and exhausted at the rear. Each cabinet can have additional cooling options; for example, they can have a Close Coupled Cooling attachable module or integrated with cabinet elements (like cooling doors in iDataPlex server rack).

Direct Contact Liquid Cooling has emerged more efficient than air cooling options, resulting in smaller footprint, lower capital requirements and lower operational costs than air cooling. It uses warm liquid instead of air to move heat away from the hottest components. Energy efficiency gains from liquid cooling is also driving its adoption.

"Cooling and Noise in Rugged Industrial Computers". Chassis Plans Rugged Computers and LCD Displays. Archived from the original on 7 January 2014. Retrieved 11 February 2016.

"GE"s "dual piezo cooling jet" could enable even cooler gadgets". gizmag.com. 14 December 2012. Archived from the original on 21 July 2013. Retrieved 20 April 2013.

Jeremy. "Air Cooling Vs Liquid Cooling For Pc What To Choose". gamesngearselite. Archived from the original on 11 February 2017. Retrieved 8 February 2017.

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Adoption Bot is a user care chat bot built with Power Virtual Agent for Teams PVA. It"s considered as the PVA version of FAQ Plus. Adoption Bot answers 100+ common questions about Microsoft 365 and Teams. You can edit the existing topics, add your own topics, and ingest existing FAQs. If users need additional help, Adoption Bot can connect them to experts or even be extended to open service tickets with premium flow connectors. This bot is self-installed or built into a custom app, such as the Adoption Hub.

Appointment Manager is a Teams app template to help businesses create, manage, and conduct virtual appointments with consumers through Teams. New appointment requests from consumers are visible in Teams channels, where they"re quickly assigned and reassigned to staff in a team. Appointment requests are viewed at team or personal levels through custom tabs. Every appointment is associated with a Teams online meeting, hence the staff and consumers can easily join the meeting at the scheduled time. The app template integrates with Microsoft Bookings for easy appointment management. Scheduled appointments automatically appear on assigned staff members" calendars, and consumers receive customizable email notifications and reminders with embedded meeting links.

Ask Away is a Microsoft Teams bot that enables users to conduct Question and Answer, called Q&A sessions within Teams. Using the Ask Away bot, team members can submit and up-vote questions shared by colleagues allowing Q&A hosts to easily gather top-of-mind questions within a channel or chat. The bot is used to conduct a real-time Q&A session in a Teams meeting and allows attendees to submit questions live through chat.

Associate Insights is a Power Apps template that empowers firstline workers to directly capture and submit customer opinion, sentiment, and perception. Firstline workers are often the first company representative to engage with customers in a one-to-one point-of contact. The collected data are shared and used collaboratively by business teams, such as through a Power BI Teams tab, for product improvement and enhancing the customer experience.

Building Access is a Microsoft Power Platform based app that supports the administration of building occupancy thresholds and social distancing norms by enabling facilities directors to manage, track, and report employee on-site presence. The app, built using Microsoft Power Apps, and Power Automate, deeply integrates with Teams and enables organizations to determine building readiness, establish eligibility criteria for on-site access, and gather insights for future planning.

Checklist is a custom Teams message extension app that enables you to collaborate with your team by creating a shared checklist in a chat or channel. The app is supported across all Teams platform clients, such as desktop browser, iOS, and Android. The app is ready for deployment as part of your Microsoft 365 subscription.

Classroom Drop-in is a Microsoft Power Platform-based app that enables system leaders to find class teams, means virtual classrooms and add themselves or others to these class teams for a specified drop-in period, as needed. The app built using Microsoft Power Apps and Power Automate, deeply integrates with Teams to ensure educational institutes can optimize their operations in a hybrid learning environment by providing access to relevant stakeholders for class teams per business requirements.

The Contact Group Lookup app provides a convenient and useful approach to creating, accessing, and managing your organization"s contact groups, formerly known as distribution lists or communication groups. Users can quickly view and chat with group members, view member status, and create a group chat with selected members in the contact group, all within the Teams environment.

The co-worker appreciation template in Teams helps users to recognize their colleagues" achievements within the Teams’ context. When co-workers select to reward a colleague, recipients and other team members are tagged in a channel conversation and they receive a notification about the channel"s award details. The awards are recorded in the Teams app, which is secure, portable, and easily shareable. This is considered as the PowerApps based version of the Open Badges app template, with a leaderboard.

Self-expression is core to a healthy team culture. This app template is a message extension that enables your users to use custom stickers and GIFs within Teams. This template provides an easy web-based configuration experience where anyone with configuration access can upload the GIFs, stickers, and images they want their users to have, allowing your entire team to use any set of stickers you choose. This app also enables easy sharing of images, GIFs, stickers across teams without needing access to SharePoint sites or individual channels as storage and sharing mechanisms. For example, product teams can easily share product images and GIFs to social media, marketing, and sales teams programmatically. One can also extend this app by triggering a notification flow to specific teams or individuals when new images, and GIFs are made available.

E-Prescriptions is a Power Apps based app that enhances telemedicine and virtual care by automating the process of issuing e-prescriptions to patients. Medical professionals can quickly review appointments, generate e-prescriptions, and send emails with e-prescription attachments to patients directly within the Teams platform.

Employee training is a Microsoft Teams app that enables organizers to easily publish, track, and promote learning and training events for your organization. With the app, event planners can send reminders and notifications to event registrants and employees can indicate interest in upcoming events, stay updated on current events, and share event details with colleagues through the Teams message extension.

Expert Finder is a Microsoft Teams bot that identifies specific organization members based on their skills, interests, and education attributes. Members find experts within an organization that match a keyword search of Microsoft Azure Active Directory (Azure AD) user profiles.

The Goal Tracker app is a comprehensive solution for your organization to support establishing goals, observing progress, and acknowledging success within Microsoft Teams. The app enables users to set, track, and update objectives on a professional, personal, and team level. Team members also receive timely reminders and status updates to remain focused and stay on track.

The Great Ideas app supports and empowers innovation and creativity within your organization. The app enables your employees to share ideas with colleagues and leadership, discover new submissions, spotlight contributions for peer consideration, and cast their vote for the best proposals within Microsoft Teams.

Group Activities is a Teams app that makes it easy for team owners to quickly create activity groups and manage collaboration workflows within the context of Teams. Activity authors are enabled to create activities, randomly distribute team members in groups, and optionally have the bot send reminders until activities are complete.

Group Connect is a Microsoft Teams app that helps organization members discover employee groups and find information relevant to employee groups. The app comes built-in with rich capabilities for organization leaders to communicate with their employees regarding groups, events, and resources. The Group Connect app also matches group members with each other at their desired frequency to encourage networking and cohesion within a group. For more information on how you can leverage the Group Connect app to help employee groups foster within your organization, see the app on GitHub.

The Grow Your Skills app supports professional growth and development by enabling employees to contribute to supplemental projects for your organization while simultaneously learning new skills. Employees can use the app to locate opportunities that meet their interests, enjoy meaningful collaboration with peers, and acquire new levels of expertise and capabilities, all within the Teams environment.

HR Support bot is a friendly Q&A bot that brings a support professional or expert from the HR team in the loop when it"s unable to help. One can ask the bot a question and the bot responds with an answer if it"s contained in the knowledge base. If not, the bot allows the user to submit a query, which then gets posted in a pre-configured team of experts who are help to provide support by acting upon the notifications from within their team itself. Additionally, the bot suggests links to recommended HR policies or questions by searching for pre-configured tags in the question. These tiles are found in the associated tab as a quick reference. HR Support works well for light weight Q&A and to provide quick support when launching new projects or initiatives in the organization.

Open Badges is a Teams app that enables individuals to earn digital learning credential badges within the Teams context and share them everywhere. Using capabilities from the third-party digital badge issuing authority, Badgr, awarded badges are recorded in a recipient"s Badgr profile and available to build and share a rich picture of lifetime learning journeys.

Quiz is a custom Teams message extension app that enables you to create a quiz within a chat or a channel for knowledge check and instantaneous results. You can use Quiz for, In-class and offline exams, Knowledge check within team, and for fun quizzes within a team. Quiz app is supported across multiple platforms, such as Teams desktop, browser, iOS, and Android clients. This app is ready for deployment as part of your existing Microsoft 365 subscription.

Rapid Assist is a Microsoft Power Platform based app that allows customer facing associates to rapidly connect with the experts to get quick answers, search for information, follow up open requests, and allow experts to receive notifications to quickly get on a call to help answer questions. The app built using Microsoft Power Apps and Power Automate, deeply integrates with Teams to enable organizations to easily connect frontline workers with corporate liaisons to resolve customer queries and deliver a great customer experience.

Reflect is a custom Teams message extension app that provides a safe and inclusive resource for your team members to share the state of their emotional well-being with colleagues or group leaders directly within Teams. The app is available in channel, group, meeting, and 1:1 chats and the check-in response is set to public, private-to-sender, or fully anonymous.

Remote Support is a Microsoft Teams bot that provides a focused interface between support requesters throughout your organization and the internal support team. End-users can submit, edit, or withdraw requests for support and the support team can respond, manage, and update requests all within the Teams platform.

Scrums for Channels is a scrum assistant app that enables users to schedule and run scrums in channels within Teams. The app is great for remote teams and teams comprised of members from varied geographical locations and time zones to share daily updates and ensure participation in scrum stand-up meetings.

The Share Now app promotes the positive exchange of information between colleagues by enabling your users to easily share content within the Teams environment. Users engage the app to share items of interest with team members, discover new shared content, set preferences, and bookmark favorites for later reading.

Collaboration in Teams often references information contained within items in a SharePoint list. Paste a link to the item in question forces everyone to switch context away from the conversation, find the needed information, then return to Teams to continue the conversation. As the conversation continues people have to switch back to the reference item multiple times to verify new comments and refresh their memories of the information contained within the item. This context switching creates a barrier to smooth collaboration. To resolve this problem, the List Search app template is used. Many users use SharePoint to power some of the core workflows in their organizations. However, collaborating around lists is difficult. Using the List Search app template in Teams, users can insert information from SharePoint list items directly within a chat conversation to alleviate the context-switching caused when simply inserting a link into a chat. The information is inserted as an easy-to-read auto-formatted card, helping the users stay engaged in the conversation.

A project can include multiple tasks, and various projects can be assigned to employees. Managers are required to understand the project progress through the time spent by the employees on these tasks. This can be a cumbersome activity, as the employees need to fill in the timesheets. Time Tally app enables employees to fill their timesheets quickly, using the mobile device, and managers don"t have to follow up with employees on the timesheet entry. Managers get to view the project utilization based on resources, and they can approve or reject the entries. Reminder notifications are sent to ensure timesheet compliance. Also, historical data and utilizations are available for analytics.

Training is a custom Teams message extension app that enables users to publish a training within a chat or a channel for offline knowledge sharing and upskilling. The app is supported across multiple Teams platform clients, such as desktop, browser, iOS, and Android. This app is ready for deployment as part of your Microsoft 365 subscription.

Hospital and emergency room providers make many rounds per day. These quick check-ins on patients are intended to provide a status check on how the patient is doing and ensure that the patient’s concerns are addressed. While rounding is an essential practice to ensure patients are being monitored by multiple types of providers, they represent a huge drain on PPE, because for each visit, from each provider, a new mask, and new set of gloves are used. With this app templates, medical workers can easily conduct rounds virtually, through a Teams meeting between the provider and the patient. The Virtual Rounding solution is also referenced in the Microsoft Health and Life Sciences blog post.

Water Cooler is a custom Teams app that enables corporate teams to create, invite, and join casual conversations among teammates, such as those that take place by the Water Cooler or break room. Use this template for multiple scenarios, such as new non project related announcements, topics of interest, current events, or conversations about hobbies. The app provides an easy interface for anyone to find an existing conversation or start a new one. It"s a foundation for building custom targeted communication capabilities, promoting interaction amongst coworkers who may otherwise not get a chance to socialize during breaks. Key features are:

Water Cooler Home Page: You can browse existing rooms where team members are interacting in existing conversations with certain people or topics of interest. Active conversations on the Home Page show a room name, short description, call duration, and room image.

The last article has introduced to you what an AIO liquid CPU cooler is, if you still don’t understand it, go and make up the progress.Is a Liquid CPU Cooler Better Than the Air Cooler? Things You Need to Know Before Buying a CPU Cooler.

Today, I want to share with you how to install an AIO liquid CPU cooler after purchasing it. What should you pay attention to during the installation process?

In an AIO liquid CPU cooler, there are many parts besides the cooler itself, such as brackets, screws, and various wires. So the first thing you do is pick up the manual and make sure all parts are there or you may not be able to install smoothly! The following is a demonstration using T-FORCE SIREN GD240E All-in-One ARGB CPU Liquid Cooler.

When you see an AIO liquid CPU cooler for the first time, the first question most people have is how do I install this? The first thing you need to pay attention to is the fans on the water cooling row. Depending on the design of each case, there may be more than one place to install. Different installation locations have different installation methods for fans. The following two installation positions are more common in the market and have been tested to have more effective heat dissipation.

The AIO liquid CPU cooler alone can’t cool down the entire PC. The PC itself must be equipped with other fan products to achieve an effective cooling effect. A quick tip, if you really forget which side is air intake and which side is the exhaust, try pushing the blades hard to feel the wind flow.

Remove the copper bottom surface protection sticker on the water block of the SIREN GD240E All-in-One ARGB CPU Liquid Cooler. Take the appropriate screws and screw them on the motherboard. The screwing method is the same, following the order of X and do not screw it too tightly at once. Lock all the screws and then tighten them in the same order, so that the water block applies force to the CPU evenly, making the CPU less likely to be damaged.

After securing the AIO liquid cooler to the case and the motherboard, the last step, and the most important step, is wiring! First, you must identify the purpose of each wire.

Since the fan and the water block of T-FORCE SIREN GD240E AIO ARGB liquid cooler have ARGB function, therefore the fan has two cables individually, one for the power and one for the ARGB signal, while the water block only has one ARGB signal cable.

Remember when AIO liquid coolers were only found in enthusiast PC builds? That"s not the case anymore, as AIO coolers have become more of a necessity with all these power-hungry CPUs from Intel and AMD.

Most air coolers are simply not powerful enough to dissipate all the heat generated by these high-wattage processors. And as such, PC builders resort to AIO liquid coolers to get the best cooling performance for their CPUs.

However, finding a suitable AIO can be tricky, as you"ll need to consider multiple factors. So, here, we"ll discover the top specs to check when buying a new AIO cooler.

Besides the price, radiator size is the most important factor you need to consider when purchasing an AIO liquid cooler. The radiator"s length should give a rough idea of the AIO"s cooling performance. The bigger the radiator, the more air it can push through, allowing it to dissipate heat quickly.

Typically, a mid-tower PC case would fit a 240mm radiator just fine, while an ITX case would need to settle for a smaller 120mm or 140mm AIO cooler. More often than not, you"ll need a full-tower PC case to fit a 360mm radiator or larger.

Besides the length of the radiator, you should also consider its thickness. Most AIO liquid coolers come with a standard radiator thickness of 27mm, but some models, like the Arctic Liquid Freezer AIO, feature a thicker 38mm radiator.

Again, if you opt for an AIO with a thicker radiator for better cooling performance, make sure you have adequate space in your case because you may encounter clearance issues with your RAM, especially on mid-tower and ITX PC builds.

The fan speed is rated in RPM (revolutions per minute), and typically, the fans that come with your AIO cooler are PWM-controlled, meaning you can control its speeds with software. Regardless, you should look at the fan"s maximum speed in the spec sheet.

Most radiator fans can spin upwards of 1,500 RPM, but you"ll find high-end AIO coolers surpass the 2,000 RPM mark. And although you may be inclined to buy the fans that spin at 2,000 RPM, you need to consider another critical factor: noise level.

The faster the fans spin, the louder your AIO cooler will be. Sure, you"ll get better cooling performance, but that could come at the cost of unbearable noise, meaning you"d have to lower the speed. So, don"t forget to check the noise levels of the included fans in the spec sheet, rated in dB. The lower this value, the better, and anything below 40dB is optimal.

A loud pump is as annoying as the loud fans in your AIO liquid cooler. So, you should make sure the pump in your AIO cooler is from a reputed manufacturer.

Most mainstream AIO liquid coolers from Corsair, ASUS, and Gigabyte use an Asetek pump, meaning pump performance will remain mostly consistent across their product lineups. However, some companies like Lian Li and EK Water Blocks manufacture their own pumps, so you"ll need to look into the reviews for the model you plan to get.

Newer generations of pumps are typically better in cooling performance. In addition, they have safety parameters to prevent any liquid leakage, allowing your AIO liquid cooler to last longer than old-gen models.

Performance should be your top priority when buying a new AIO liquid cooler, but that doesn"t mean you should skip the aesthetics department. Nowadays, most PC cases come with tempered glass side panels to show off your hardware in all its glory, so why not add some RGB flair?

Several AIO liquid coolers today pack RGB fans to give you some decent lighting inside your cabinet, and they don"t cost much more than their non-RGB counterparts. However, make sure the one you choose has addressable RGB fans, as these allow you to control the color of each LED individually.

And if you can afford the premium prices for high-end AIO coolers, try to get one with an LCD screen. While you may quickly shrug it off as an unnecessary gimmick, it can be convenient to monitor your CPU temperature and clock speed while playing games instead of using your PC monitoring software.

Now that you know all the specifications you need to consider, you"re all set to buy your very first AIO liquid cooler. However, don"t forget to factor in the price, as your budget will ultimately decide what AIO you get.

If you"re building a mid-tower PC on a budget, a 240mm AIO cooler would be a logical choice, but if you can afford the best of the best, don"t settle for anything less than a 360mm liquid cooler, provided your case can fit it—save the 120mm AIOs for ITX builds.

This All-in-One (AIO) liquid cooler is ready for high performance CPUs with the ability to fit in most cases. Show CPU/GPU temperatures or customize with GIFs with the Kraken Z LCD display.2.36” LCD screen capable of displaying 24-bit color

Ever since it was founded back in 2004, NZXT has been focused on the always-lucrative PC gaming market. The company started out with just a few PC cases, yet their unique aesthetics and features were more than enough to let the company establish a solid foothold in the advanced PC market. Several years later, NZXT slowly began diversifying their product portfolio by adding cooling and power products to it. Today, the company produces a large variety of PC cases, cooling, and power products, as well as PC peripherals and accessories.

NZXT entered the PC cooling market nearly a decade ago by releasing all-in-one (AIO) liquid cooling solutions and accessories for them, including GPU mounting brackets. However unlike other manufacturers who have opted to build large, diverse product lineups, NZXT never kept more than a handful of AIO coolers available in their product line-up. Instead, the company has focused on delivering a few quality and aesthetically-unique designs, rather than trying to take the competition down on raw performance alone.

Today we are taking a look at NZXT’s latest liquid coolers, the Kraken X-3 and Z-3 series. These are more of a refresh rather a total upgrade over last year’s X-2 series, but NZXT has made some notable tweaks. Between the two families there are five different coolers in three sizes, covering the usual 240/280/360mm configurations. Both the X and Z series utilize the same cooling hardware, but NZXT has positioned the Z series as a premium option with a novel aesthetic feature – while the X series has RGB lighting on top of the pump base, the Z series tops its base with a full-fledged (and full color) LCD screen.

For this review we"re checking out both the X73 and the Z63, giving us a full view of the performance and features we can expect from most coolers that NZXT currently offers.

The new Kraken Z-3 and X-3 coolers ship in relatively simple packaging, based on the same white/purple artistic theme that NZXT has used over the last few years. A picture of the cooler covers the otherwise plain front of the packaging. Inside the box we found the coolers and their parts well protected by custom cardboard inserts.

All of the coolers share practically the same bundle, which is limited to the basics. Inside the box we only found the required mounting hardware, the necessary wiring, and an installation manual. We should also note that NZXT does not include the TR4 socket mounting plate by default, but they do have one available as an optional part for Threadripper owners.

The NZXT Z63 and X73 come with two 140