moto z force lcd panel price in pakistan quotation

Want To Buy Mobile Phones LCD Panel Unit Touch Screen In Pakistan? We’ll Deliver You the Lowest Price & Supreme Quality Mobile, Tablet, Laptop & Smart Watch Spare Parts All Over In Pakistan. DMarket.Pk will Never Be Beaten on Choice, Quality. There is a Bunch of Reasons why our Customers Keep Coming Back!

Motorola Moto Z Force LCD Unit Panel Connect to your phone motherboard without actually completely fitting the product and without removing any protection film.

Motorola Moto Z Force LCD Panel Test functionality. If the product seem to be working fine, then attach the product to the phone and try to use the product for few hours, again without removing the protection warranty film and don’t paste glue.

When you are totally satisfied with the product functionality, you can now remove all the protection warranty film and use your phone normally (Removing the protective warranty film means acceptance of the item).

If you do not find suitable Mobile Phones, Tablet & Apple Watches Part’s.We will struggle to supply the searched product As Soon As Possible. Just Submit

Professional QC Team to control the quality of the parts to make sure our products always Top quality. Do business with us to ensure your money buys the right Goods.

TFT LCD: A thin-film transistor liquid crystal display (TFT LCD) is a type of liquid crystal display (LCD) that makes use of thin-film transistor technology in order to improve qualities such as contrast and addressability. TFT technology means that an individual transistor is used to drive each individual pixel, allowing for faster response times.

InCell: In-cell displays are revolutionary in the sense that they combine a digitizer, use touch input, and integrate an LCD screen into a single-layer display. Some reports also suggest that in-cell technology displays provide better resolution compared to standard LCD screens.

IPS LCD: IPS LCDs are the next level of TFT LCD displays providing wider viewing angles and lower power consumption which leads to much-improved battery life. IPS-LCDs obviously are costlier than normal TFT LCD.

OLED: This happens to be the newest technology in for displays of mobiles and monitors. As far as the OLED tech is concerned you will find an organic material which is placed between two conducting sheets (an anode and a cathode), which are also put between a glass top plate (seal) and a glass-bottom plate (substrate).

AMOLED: AMOLED is a different type of OLED displays for mobiles and are fast gaining popularity in the top-end smartphone segment. AMOLED screens can show us many things that we are present on OLED display like brilliant color reproduction, lightweight, good battery life, proper brightness, etc.

Super AMOLED: Super AMOLED displays take upon the AMOLED displays and is primarily developed by Samsung. Super AMOLED is constructed with touch sensors placed on the display itself, as opposed to creating a separate touch-sensitive layer (as in capacitive touch screen). This makes it the thinnest display technology on the market. Super AMOLED displays are currently only present in Samsung devices but more phones could use the technology in the future.

If you are satisfied with our service and product, please leave us 5 stars positive feedback, and we will give you good geed feedback soon. If you are not satisfied with our service or products, hope you can give us an opportunity to make things better before you leave negative feedback.Please contact us for the first time if you have any complain, we will listen to you patiently, and try our best to help you solve the problems until you are happy. Business is not easy, hope we can understand with each other, the aim of us for a long time cooperation, never let you down.

Disclaimer:Motorola Moto Z Force LCD Replacement Display Touch Screen Digitizer Price is updated on regular basis from the authentic sources of local shops and official dealers. However, we do not guarantee the price of the Product mentioned here due to differences in USD conversion frequently as well as market price fluctuation.

Q: What is the Meaning of the Motorola Moto Z LCD Panel Unit?If you are confused, then let us clear that the Panel (or Unit) is a complete display unit that consists of a display and touch screen glass. The simple meaning of a Panel is a complete unit of display and touch screen digitizer glass combined into a single unit. If you replace the panel, you can quickly restore your phone’s working condition in no time.

Q: How can I replace only the front glass without replacing the Panel?In most cases of screen damage, only the touch screen glass will receive the scratches, and the display will stay intact. In such cases, customers want to replace only the glass and retain the same display. Essentially, customers are looking to repair the damaged screen anyhow, and such operations are carried out in local markets where mechanics try to replace only the glass.

Q: Is it possible to test the panel without installing it?Many customers think that It is not possible to test the Panel without fitting it completely on their mobile. However, It is not true as you can easily connect the display temporarily to the motherboard and test everything, we also use the same mechanism to verify the display.

This is a completely risk-free process when you test the display before fitting. Simply ask the mechanic to connect the display temporarily to the motherboard and test it completely without pasting glue/double tape or removing the protective films. After verifying that everything is 100% perfect according to your desire, you can do the final fitting!

The variety of screens panel is huge in this industry, and everyone can’t keep all the models ready. That requires a lot of investment, which is typically not possible in small towns and even in metro cities. On top of that, availability is a big issue, and you can’t find the spare parts no matter how much cash you offer. If a model is no longer being manufactured, the prices shoot up, and you can’t even find the replacement parts for the said model.

The normal installation charges are around Rs 300-500, and you should always consult with a technician before installing the display. We suggest that you don’t try to install the display at home because that could have adverse results if you don’t know how to install the display with expertise.

Q: What if the display breaks during transit?We are aware that Panel display is very fragile and requires the safest possible packing. That’s why we pack your products in hard thermocol boxes accompanied by multiple layers of additional products, and so far, our clients have never faced a broken display issue.

Still, we know that customers are not satisfied until the products reach to them in a safe condition. Therefore, we suggest all customers record an unboxing video when you open the parcel.

Yes. We make sure to simulate the testing process before shipping the spare parts to our customers. The chances of receiving a defective or non-working part are almost non-existent. In case you face any issues. You can always contact us at

TFT LCD:A thin-film transistor liquid crystal display (TFT LCD) is a type of liquid crystal display (LCD) that makes use of thin-film transistor technology in order to improve qualities such as contrast and addressability. TFT technology means that an individual transistor is used to drive each individual pixel, allowing for faster response times.

IPS LCD:IPS LCDs are the next level of TFT LCD displays providing wider viewing angles and lower power consumption which leads to much-improved battery life. IPS-LCDs obviously are costlier than normal TFT LCD.

OLED:This happens to be the newest technology in for displays of mobiles and monitors. As far as the OLED tech is concerned you will find an organic material which is placed between two conducting sheets (an anode and a cathode), which are also put between a glass top plate (seal) and a glass-bottom plate (substrate).

AMOLED:AMOLED is a different type of OLED displays for mobiles and are fast gaining popularity in the top-end smartphone segment. AMOLED screens can show us many things that we are present on OLED display like brilliant color reproduction, lightweight, good battery life, proper brightness, etc.

Super AMOLED:Super AMOLED displays take upon the AMOLED displays and is primarily developed by Samsung. Super AMOLED is constructed with touch sensors placed on the display itself, as opposed to creating a separate touch-sensitive layer (as in capacitive touch screen). This makes it the thinnest display technology on the market. Super AMOLED displays are currently only present in Samsung devices but more phones could use the technology in the future.

Before attempting any repair, be sure to ground yourself is an ESD (electro static discharge) strap. This will prevent static electricity from damaging the electronic components within the phone.

Screen replacement is very fragile product. We strongly suggest test before installation. Please simulates testing, which means mobile phone apart, (motherboard + LCD or screen) connected audio cable and new replacement, power on, test finished. If test OK, please install it. If it can not show, please contact us at the very first time. And please do not force it to be installed in mobile phone. We will not be responsible once the screen is installed.

Android, Google, Google Play, Nexus and other marks are trademarks of Google LLC. The Android robot is reproduced or modified from work created and shared by Google and used according to terms described in the Creative Commons 3.0 Attribution License. Oreo is a trademark of Mondelez International, Inc. group.

Tired of scratch, abrasion and shattered screens but also want cool looks? Discover the uniquely designed motorola moto z2 force at Alibaba.com. Most smartphones are designed to be metallic or glass-made and keeping them secured could be a tough job. A good quality motorola moto z2 force can go a long way along with showcasing the beauty of your phone. Alibaba.com could be a perfect place to find the exact motorola moto z2 force for your mobile phones.

These motorola moto z2 force are made up of materials that are resistant to heat, moisture, scratch and dust hence help in giving a longer life to your mobile phones. motorola moto z2 force are also seen as accessories that will enhance the overall aesthetics of your phone along with securing it and keeping it lightweight. You can even avail the option to get your motorola moto z2 force customized as per your need.

There are several latest additions to the collection of motorola moto z2 force that are currently trending and receiving a lot of attention by many users. Some motorola moto z2 force even come with wallet like features and some may even have flip covers to give extra refuge to the screen while some motorola moto z2 force may be tuned up to a stand to act as a holder for your phone and prevent straining of fingers with long hours of usage.

If you are looking for a reasonable range of motorola moto z2 force, Alibaba.com is ready with answers through its plethora of items that satisfy both personal and wholesale purposes.

The motorola Z3 LCD may vary depending on the material, size, and design of the LCD. For motorola Z3 LCD, depending on the material, the features, and other design of the LCD. motorola Z3 lcd may vary depending on their design and features. However, motorola Z3 LCD may vary more on the market, and one of them is motorola Z3 Lcd. While motorola Z3 lcd may vary more on than motorola Z3 Lcd, and Z3 One are the more basic choices and motorola Z3 one may be the same as others.

As for the motorola Z3 lcd price, depending on the material and quality of the screen. As a retailer, one of the main options for LCD materials is suitable for using cellular phones.

motorola Z3 lcdds are excellent for as performance as well, which makes one feel more professional and reliable. Some of the motorola Z3 lcdds are excellent, while Z3 display complete have a built-in screen protector and other design. Other motorola Z3 lcdds are excellent as they have built-in screen protectors, and Z3 T-shirts are the only ones sold by wholesalers on Alibaba.com.

This website is using a security service to protect itself from online attacks. The action you just performed triggered the security solution. There are several actions that could trigger this block including submitting a certain word or phrase, a SQL command or malformed data.

Part of a 1984 Sinclair ZX Spectrum computer board, a PCB, showing the conductive traces, vias (the through-hole paths to the other surface), and some electronic components mounted using through-hole mounting

A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds vias: plated-through holes that allow interconnections between layers.

Printed circuit boards are used in nearly all electronic products. Alternatives to PCBs include wire wrap and point-to-point construction, both once popular but now rarely used. PCBs require additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Electronic design automation software is available to do much of the work of layout. Mass-producing circuits with PCBs is cheaper and faster than with other wiring methods, as components are mounted and wired in one operation. Large numbers of PCBs can be fabricated at the same time, and the layout has to be done only once. PCBs can also be made manually in small quantities, with reduced benefits.

PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology. However, multilayer PCBs make repair, analysis, and field modification of circuits much more difficult and usually impractical.

Before the development of printed circuit boards, electrical and electronic circuits were wired point-to-point on a chassis. Typically, the chassis was a sheet metal frame or pan, sometimes with a wooden bottom. Components were attached to the chassis, usually by insulators when the connecting point on the chassis was metal, and then their leads were connected directly or with jumper wires by soldering, or sometimes using crimp connectors, wire connector lugs on screw terminals, or other methods. Circuits were large, bulky, heavy, and relatively fragile (even discounting the breakable glass envelopes of the vacuum tubes that were often included in the circuits), and production was labor-intensive, so the products were expensive.

Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch method in the UK, and in the United States Max Schoop[de] obtained a patent

Predating the printed circuit invention, and similar in spirit, was John Sargrove"s 1936–1947 Electronic Circuit Making Equipment (ECME) which sprayed metal onto a Bakelite plastic board. The ECME could produce three radio boards per minute.

A PCB as a design on a computer (left) and realized as a board assembly populated with components (right). The board is double sided, with through-hole plating, green solder resist and a white legend. Both surface mount and through-hole components have been used.

The Austrian engineer Paul Eisler invented the printed circuit as part of a radio set while working in the UK around 1936. In 1941 a multi-layer printed circuit was used in German magnetic influence naval mines.

Around 1943 the USA began to use the technology on a large scale to make proximity fuzes for use in World War II.screenprinted with metallic paint for conductors and carbon material for resistors, with ceramic disc capacitors and subminiature vacuum tubes soldered in place.Institute of Electrical and Electronics Engineers (IEEE) awarded Harry W. Rubinstein the Cledo Brunetti Award for early key contributions to the development of printed components and conductors on a common insulating substrate. Rubinstein was honored in 1984 by his alma mater, the University of Wisconsin-Madison, for his innovations in the technology of printed electronic circuits and the fabrication of capacitors.integrated circuit technology, as not only wiring but also passive components were fabricated on the ceramic substrate.

In 1948, the USA released the invention for commercial use. Printed circuits did not become commonplace in consumer electronics until the mid-1950s, after the Auto-Sembly process was developed by the United States Army. At around the same time in the UK work along similar lines was carried out by Geoffrey Dummer, then at the RRDE.

Motorola was an early leader in bringing the process into consumer electronics, announcing in August 1952 the adoption of "plated circuits" in home radios after six years of research and a $1M investment.

Even as circuit boards became available, the point-to-point chassis construction method remained in common use in industry (such as TV and hi-fi sets) into at least the late 1960s. Printed circuit boards were introduced to reduce the size, weight, and cost of parts of the circuitry. In 1960, a small consumer radio receiver might be built with all its circuitry on one circuit board, but a TV set would probably contain one or more circuit boards.

Originally, every electronic component had wire leads, and a PCB had holes drilled for each wire of each component. The component leads were then inserted through the holes and soldered to the copper PCB traces. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. The patent they obtained in 1956 was assigned to the U.S. Army.lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are inefficient since drilling holes is expensive and consumes drill bits and the protruding wires are cut off and discarded.

From the 1980s onward, small surface mount parts have been used increasingly instead of through-hole components; this has led to smaller boards for a given functionality and lower production costs, but with some additional difficulty in servicing faulty boards.

In the 1990s the use of multilayer surface boards became more frequent. As a result, size was further minimized and both flexible and rigid PCBs were incorporated in different devices. In 1995 PCB manufacturers began using microvia technology to produce High-Density Interconnect (HDI) PCBs.

Recent advances in 3D printing have meant that there are several new techniques in PCB creation. 3D printed electronics (PEs) can be utilized to print items layer by layer and subsequently the item can be printed with a liquid ink that contains electronic functionalities.

HDI (High Density Interconnect) technology allows for a denser design on the PCB and thus potentially smaller PCBs with more traces and/or components in a given area. As a result, the paths between components can be shorter. HDIs use blind/buried vias, or a combination that includes microvias. With multi-layer HDI PCBs the interconnection of several vias stacked on top of each other (stacked vías, instead of one deep buried via) can be made stronger, thus enhancing reliability in all conditions. The most common applications for HDI technology are computer and mobile phone components as well as medical equipment and military communication equipment. A 4-layer HDI microvia PCB is equivalent in quality to an 8-layer through-hole PCB, so HDI technology can reduce costs.

A basic PCB consists of a flat sheet of insulating material and a layer of copper foil, laminated to the substrate. Chemical etching divides the copper into separate conducting lines called tracks or circuit traces, pads for connections, vias to pass connections between layers of copper, and features such as solid conductive areas for electromagnetic shielding or other purposes. The tracks function as wires fixed in place, and are insulated from each other by air and the board substrate material. The surface of a PCB may have a coating that protects the copper from corrosion and reduces the chances of solder shorts between traces or undesired electrical contact with stray bare wires. For its function in helping to prevent solder shorts, the coating is called solder resist or solder mask.

The pattern to be etched into each copper layer of a PCB is called the "artwork". The etching is usually done using photoresist which is coated onto the PCB, then exposed to light projected in the pattern of the artwork. The resist material protects the copper from dissolution into the etching solution. The etched board is then cleaned. A PCB design can be mass-reproduced in a way similar to the way photographs can be mass-duplicated from film negatives using a photographic printer.

FR-4 glass epoxy is the most common insulating substrate. Another substrate material is cotton paper impregnated with phenolic resin, often tan or brown.

When a PCB has no components installed, it is less ambiguously called a printed wiring board (PWB) or etched wiring board. However, the term "printed wiring board" has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). In informal usage, the term "printed circuit board" most commonly means "printed circuit assembly" (with components). The IPC preferred term for an assembled board is circuit card assembly (CCA),backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly".

A PCB may be printed with a legend identifying the components, test points, or identifying text. Originally, silkscreen printing was used for this purpose, but today other, finer quality printing methods are usually used. Normally the legend does not affect the function of a PCBA.

A printed circuit board can have multiple layers of copper which almost always are arranged in pairs. The number of layers and the interconnection designed between them (vias, PTHs) provide a general estimate of the board complexity. Using more layers allow for more routing options and better control of signal integrity, but are also time consuming and costly to manufacture. Likewise, selection of the vias for the board also allow fine tuning of the board size, escaping of signals off complex ICs, routing, and long term reliability, but are tightly coupled with production complexity and cost.

One of the simplest boards to produce is the two-layer board. It has copper on both sides that are referred to as external layers; multi layer boards sandwich additional internal layers of copper and insulation. After two-layer PCBs, the next step up is the four-layer. The four layer board adds significantly more routing options in the internal layers as compared to the two layer board, and often some portion of the internal layers is used as ground plane or power plane, to achieve better signal integrity, higher signaling frequencies, lower EMI, and better power supply decoupling.

In multi-layer boards, the layers of material are laminated together in an alternating sandwich: copper, substrate, copper, substrate, copper, etc.; each plane of copper is etched, and any internal vias (that will not extend to both outer surfaces of the finished multilayer board) are plated-through, before the layers are laminated together. Only the outer layers need be coated; the inner copper layers are protected by the adjacent substrate layers.

A box of drill bits used for making holes in printed circuit boards. While tungsten-carbide bits are very hard, they eventually wear out or break. Drilling is a considerable part of the cost of a through-hole printed circuit board

"Through hole" components are mounted by their wire leads passing through the board and soldered to traces on the other side. "Surface mount" components are attached by their leads to copper traces on the same side of the board. A board may use both methods for mounting components. PCBs with only through-hole mounted components are now uncommon. Surface mounting is used for transistors, diodes, IC chips, resistors, and capacitors. Through-hole mounting may be used for some large components such as electrolytic capacitors and connectors.

The first PCBs used through-hole technology, mounting electronic components by leads inserted through holes on one side of the board and soldered onto copper traces on the other side. Boards may be single-sided, with an unplated component side, or more compact double-sided boards, with components soldered on both sides. Horizontal installation of through-hole parts with two axial leads (such as resistors, capacitors, and diodes) is done by bending the leads 90 degrees in the same direction, inserting the part in the board (often bending leads located on the back of the board in opposite directions to improve the part"s mechanical strength), soldering the leads, and trimming off the ends. Leads may be soldered either manually or by a wave soldering machine.signal traces on layers immediately below the top layer on multi-layer boards, since the holes must pass through all layers to the opposite side. Once surface-mounting came into use, small-sized SMD components were used where possible, with through-hole mounting only of components unsuitably large for surface-mounting due to power requirements or mechanical limitations, or subject to mechanical stress which might damage the PCB (e.g. by lifting the copper off the board surface).

Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much smaller PCB assemblies with much higher circuit densities.

Surface mounting lends itself well to a high degree of automation, reducing labor costs and greatly increasing production rates compared with through-hole circuit boards. Components can be supplied mounted on carrier tapes. Surface mount components can be about one-quarter to one-tenth of the size and weight of through-hole components, and passive components much cheaper. However, prices of semiconductor surface mount devices (SMDs) are determined more by the chip itself than the package, with little price advantage over larger packages, and some wire-ended components, such as 1N4148 small-signal switch diodes, are actually significantly cheaper than SMD equivalents.

Each trace consists of a flat, narrow part of the copper foil that remains after etching. Its resistance, determined by its width, thickness, and length, must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return. For microwave circuits, transmission lines can be laid out in a planar form such as stripline or microstrip with carefully controlled dimensions to assure a consistent impedance. In radio-frequency and fast switching circuits the inductance and capacitance of the printed circuit board conductors become significant circuit elements, usually undesired; conversely, they can be used as a deliberate part of the circuit design, as in distributed-element filters, antennae, and fuses, obviating the need for additional discrete components. High density interconnects (HDI) PCBs have tracks and/or vias with a width or diameter of under 152 micrometers.

Laminates are manufactured by curing under pressure and temperature layers of cloth or paper with thermoset resin to form an integral final piece of uniform thickness. The size can be up to 4 by 8 feet (1.2 by 2.4 m) in width and length. Varying cloth weaves (threads per inch or cm), cloth thickness, and resin percentage are used to achieve the desired final thickness and dielectric characteristics. Available standard laminate thickness are listed in

The cloth or fiber material used, resin material, and the cloth to resin ratio determine the laminate"s type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced. Important characteristics are the level to which the laminate is fire retardant, the dielectric constant (er), the loss tangent (tan δ), the tensile strength, the shear strength, the glass transition temperature (Tg), and the Z-axis expansion coefficient (how much the thickness changes with temperature).

There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy), CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven glass and epoxy), CEM-5 (woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability.

With decreasing size of board features and increasing frequencies, small nonhomogeneities like uneven distribution of fiberglass or other filler, thickness variations, and bubbles in the resin matrix, and the associated local variations in the dielectric constant, are gaining importance.

The circuitboard substrates are usually dielectric composite materials. The composites contain a matrix (usually an epoxy resin) and a reinforcement (usually a woven, sometimes nonwoven, glass fibers, sometimes even paper), and in some cases a filler is added to the resin (e.g. ceramics; titanate ceramics can be used to increase the dielectric constant).

The reinforcement type defines two major classes of materials: woven and non-woven. Woven reinforcements are cheaper, but the high dielectric constant of glass may not be favorable for many higher-frequency applications. The spatially nonhomogeneous structure also introduces local variations in electrical parameters, due to different resin/glass ratio at different areas of the weave pattern. Nonwoven reinforcements, or materials with low or no reinforcement, are more expensive but more suitable for some RF/analog applications.

At the glass transition temperature the resin in the composite softens and significantly increases thermal expansion; exceeding Tg then exerts mechanical overload on the board components - e.g. the joints and the vias. Below Tg the thermal expansion of the resin roughly matches copper and glass, above it gets significantly higher. As the reinforcement and copper confine the board along the plane, virtually all volume expansion projects to the thickness and stresses the plated-through holes. Repeated soldering or other exposition to higher temperatures can cause failure of the plating, especially with thicker boards; thick boards therefore require a matrix with a high Tg.

The materials used determine the substrate"s dielectric constant. This constant is also dependent on frequency, usually decreasing with frequency. As this constant determines the signal propagation speed, frequency dependence introduces phase distortion in wideband applications; as flat a dielectric constant vs frequency characteristics as is achievable is important here. The impedance of transmission lines decreases with frequency, therefore faster edges of signals reflect more than slower ones.

Dielectric breakdown voltage determines the maximum voltage gradient the material can be subjected to before suffering a breakdown (conduction, or arcing, through the dielectric).

Loss tangent determines how much of the electromagnetic energy from the signals in the conductors is absorbed in the board material. This factor is important for high frequencies. Low-loss materials are more expensive. Choosing unnecessarily low-loss material is a common engineering error in high-frequency digital design; it increases the cost of the boards without a corresponding benefit. Signal degradation by loss tangent and dielectric constant can be easily assessed by an eye pattern.

Moisture absorption occurs when the material is exposed to high humidity or water. Both the resin and the reinforcement may absorb water; water also may be soaked by capillary forces through voids in the materials and along the reinforcement. Epoxies of the FR-4 materials are not too susceptible, with absorption of only 0.15%. Teflon has very low absorption of 0.01%. Polyimides and cyanate esters, on the other side, suffer from high water absorption. Absorbed water can lead to significant degradation of key parameters; it impairs tracking resistance, breakdown voltage, and dielectric parameters. Relative dielectric constant of water is about 73, compared to about 4 for common circuit board materials. Absorbed moisture can also vaporize on heating, as during soldering, and cause cracking and delamination,

FR-2, phenolic paper or phenolic cotton paper, paper impregnated with a phenol formaldehyde resin. Common in consumer electronics with single-sided boards. Electrical properties inferior to FR-4. Poor arc resistance. Generally rated to 105 °C.

FR-4, a woven fiberglass cloth impregnated with an epoxy resin. Low water absorption (up to about 0.15%), good insulation properties, good arc resistance. Very common. Several grades with somewhat different properties are available. Typically rated to 130 °C.

Aluminum, or metal core board or insulated metal substrate (IMS), clad with thermally conductive thin dielectric - used for parts requiring significant cooling - power switches, LEDs. Consists of usually single, sometimes double layer thin circuit board based on e.g. FR-4, laminated on aluminum sheet metal, commonly 0.8, 1, 1.5, 2 or 3 mm thick. The thicker laminates sometimes also come with thicker copper metalization.

Kapton or UPILEX,polyimide foil. Used for flexible printed circuits, in this form common in small form-factor consumer electronics or for flexible interconnects. Resistant to high temperatures.

PTFE, ("Teflon") - expensive, low dielectric loss, for high frequency applications, very low moisture absorption (0.01%), mechanically soft. Difficult to laminate, rarely used in multilayer applications.

PTFE, ceramic filled - expensive, low dielectric loss, for high frequency applications. Varying ceramics/PTFE ratio allows adjusting dielectric constant and thermal expansion.

Copper thickness of PCBs can be specified directly or as the weight of copper per area (in ounce per square foot) which is easier to measure. One ounce per square foot is 1.344 mils or 34 micrometers thickness. Heavy copper is a layer exceeding three ounces of copper per ft2, or approximately 0.0042 inches (4.2 mils, 105 μm) thick. Heavy copper layers are used for high current or to help dissipate heat.

On the common FR-4 substrates, 1 oz copper per ft2 (35 µm) is the most common thickness; 2 oz (70 µm) and 0.5 oz (17.5 µm) thickness is often an option. Less common are 12 and 105 µm, 9 µm is sometimes available on some substrates. Flexible substrates typically have thinner metalization. Metal-core boards for high power devices commonly use thicker copper; 35 µm is usual but also 140 and 400 µm can be encountered.

In the USA, copper foil thickness is specified in units of ounces per square foot (oz/ft2), commonly referred to simply as ounce. Common thicknesses are 1/2 oz/ft2 (150 g/m2), 1 oz/ft2 (300 g/m2), 2 oz/ft2 (600 g/m2), and 3 oz/ft2 (900 g/m2). These work out to thicknesses of 17.05 μm (0.67 thou), 34.1 μm (1.34 thou), 68.2 μm (2.68 thou), and 102.3 μm (4.02 thou), respectively. 1/2 oz/ft2 foil is not widely used as a finished copper weight, but is used for outer layers when plating for through holes will increase the finished copper weight Some PCB manufacturers refer to 1 oz/ft2 copper foil as having a thickness of 35 μm (may also be referred to as 35 μ, 35 micron, or 35 mic).

Manufacturing starts from the fabrication data generated by computer aided design, and component information. The fabrication data is read into the CAM (Computer Aided Manufacturing) software. CAM performs the following functions:

Initially PCBs were designed manually by creating a photomask on a clear mylar sheet, usually at two or four times the true size. Starting from the schematic diagram the component pin pads were laid out on the mylar and then traces were routed to connect the pads. Rub-on dry transfers of common component footprints increased efficiency. Traces were made with self-adhesive tape. Pre-printed non-reproducing grids on the mylar assisted in layout. The finished photomask was photolithographically reproduced onto a photoresist coating on the blank copper-clad boards.

Layer stack of the PCB is decided, with one to tens of layers depending on complexity. Ground and power planes are decided. A power plane is the counterpart to a ground plane and behaves as an AC signal ground while providing DC power to the circuits mounted on the PCB. Signal interconnections are traced on signal planes. Signal planes can be on the outer as well as inner layers. For optimal EMI performance high frequency signals are routed in internal layers between power or ground planes.

Line impedance is determined using dielectric layer thickness, routing copper thickness and trace-width. Trace separation is also taken into account in case of differential signals. Microstrip, stripline or dual stripline can be used to route signals.

Several small printed circuit boards can be grouped together for processing as a panel. A panel consisting of a design duplicated n-times is also called an n-panel, whereas a multi-panel combines several different designs onto a single panel. The outer tooling strip often includes tooling holes, a set of panel fiducials, a test coupon, and may include hatched copper pour or similar patterns for even copper distribution over the whole panel in order to avoid bending. The assemblers often mount components on panels rather than single PCBs because this is efficient. Panelization may also be necessary for boards with components placed near an edge of the board because otherwise the board could not be mounted during assembly. Most assembly shops require a free area of at least 10 mm around the board.

The first step is to replicate the pattern in the fabricator"s CAM system on a protective mask on the copper foil PCB layers. Subsequent etching removes the unwanted copper unprotected by the mask. (Alternatively, a conductive ink can be ink-jetted on a blank (non-conductive) board. This technique is also used in the manufacture of hybrid circuits.)

Laser resist ablation Spray black paint onto copper clad laminate, place into CNC laser plotter. The laser raster-scans the PCB and ablates (vaporizes) the paint where no resist is wanted. (Note: laser copper ablation is rarely used and is considered experimental.

Laser-printed resist: Laser-print onto toner transfer paper, heat-transfer with an iron or modified laminator onto bare laminate, soak in water bath, touch up with a marker, then etch.

The process by which copper traces are applied to the surface is known as etching after the subtractive method of the process, though there are also additive and semi-additive methods.

Subtractive methods remove copper from an entirely copper-coated board to leave only the desired copper pattern. The simplest method, used for small-scale production and often by hobbyists, is immersion etching, in which the board is submerged in etching solution such as ferric chloride. Compared with methods used for mass production, the etching time is long. Heat and agitation can be applied to the bath to speed the etching rate. In bubble etching, air is passed through the etchant bath to agitate the solution and speed up etching. Splash etching uses a motor-driven paddle to splash boards with etchant; the process has become commercially obsolete since it is not as fast as spray etching. In spray etching, the etchant solution is distributed over the boards by nozzles, and recirculated by pumps. Adjustment of the nozzle pattern, flow rate, temperature, and etchant composition gives predictable control of etching rates and high production rates.

In additive methods the pattern is electroplated onto a bare substrate using a complex process. The advantage of the additive method is that less material is needed and less waste is produced. In the full additive process the bare laminate is covered with a photosensitive film which is imaged (exposed to light through a mask and then developed which removes the unexposed film). The exposed areas are sensitized in a chemical bath, usually containing palladium and similar to that used for through hole plating which makes the exposed area capable of bonding metal ions. The laminate is then plated with copper in the sensitized areas. When the mask is stripped, the PCB is finished.

Semi-additive is the most common process: The unpatterned board has a thin layer of copper already on it. A reverse mask is then applied. (Unlike a subtractive process mask, this mask exposes those parts of the substrate that will eventually become the traces.) Additional copper is then plated onto the board in the unmasked areas; copper may be plated to any desired weight. Tin-lead or other surface platings are then applied. The mask is stripped away and a brief etching step removes the now-exposed bare original copper laminate from the board, isolating the individual traces. Some single-sided boards which have plated-through holes are made in this way. General Electric made consumer radio sets in the late 1960s using additive boards. The (semi-)additive process is commonly used for multi-layer boards as it facilitates the plating-through of the holes to produce conductive vias in the circuit board.

Industrial etching is usually done with ammonium persulfate or ferric chloride. For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away.

Cut through a SDRAM-module, a multi-layer PCB (BGA mounted). Note the via, visible as a bright copper-colored band running between the top and bottom layers of the board.

Multi-layer printed circuit boards have trace layers inside the board. This is achieved by laminating a stack of materials in a press by applying pressure and heat for a period of time. This results in an inseparable one piece product. For example, a four-layer PCB can be fabricated by starting from a two-sided copper-clad laminate, etch the circuitry on both sides, then laminate to the top and bottom pre-preg and copper foil. It is then drilled, plated, and etched again to get traces on top and bottom layers.

The inner layers are given a complete machine inspection before lamination because mistakes cannot be corrected afterwards. Automatic optical inspection (AOI) machines compare an image of the board with the digital image generated from the original design data. Automated Optical Shaping (AOS) machines can then add missing copper or remove excess copper using a laser, reducing the number of PCBs that have to be discarded.

Holes through a PCB are typically drilled with drill bits made of solid coated tungsten carbide. Coated tungsten carbide is used because board materials are abrasive. High-speed-steel bits would dull quickly, tearing the copper and ruining the board. Drilling is done by computer-controlled drilling machines, using a drill file or Excellon file that describes the location and size of each drilled hole.

Holes may be made conductive, by electroplating or inserting hollow metal eyelets, to connect board layers. Some conductive holes are intended for the insertion of through-hole-component leads. Others used to connect board layers, are called vias.

When vias with a diameter smaller than 76.2 micrometers are required, drilling with mechanical bits is impossible because of high rates of wear and breakage. In this case, the vias may be laser drilled—evaporated by lasers. Laser-drilled vias typically have an inferior surface finish inside the hole. These holes are called micro vias and can have diameters as small as 10 micrometers.controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing through the entire board. These holes are called blind vias when they connect an internal copper layer to an outer layer, or buried vias when they connect two or more internal copper layers and no outer layers. Laser drilling machines can drill thousands of holes per second and can use either UV or CO2 lasers.

The hole walls for boards with two or more layers can be made conductive and then electroplated with copper to form plated-through holes. These holes electrically connect the conducting layers of the PCB. For multi-layer boards, those with three layers or more, drilling typically produces a smear of the high temperature decomposition products of bonding agent in the laminate system. Before the holes can be plated through, this smear must be removed by a chemical de-smear process, or by plasma-etch. The de-smear process ensures that a good connection is made to the copper layers when the hole is plated through. On high reliability boards a process called etch-back is performed chemically with a potassium permanganate based etchant or plasma etching. The etch-back removes resin and the glass fibers so that the copper layers extend into the hole and as the hole is plated become integral with the deposited copper.

After PCBs are etched and then rinsed with water, the solder mask is applied, and then any exposed copper is coated with solder, nickel/gold, or some other anti-corrosion coating.

Matte solder is usually fused to provide a better bonding surface for bare copper. Treatments, such as benzimidazolethiol, prevent surface oxidation of bare copper. The places to which components will be mounted are typically plated, because untreated bare copper oxidizes quickly, and therefore is not readily solderable. Traditionally, any exposed copper was coated with solder by hot air (solder) levelling (HASL aka HAL). The HASL finish prevents oxidation from the underlying copper, thereby guaranteeing a solderable surface. This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU, which restricts the use of lead. One of these lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60 ppm germanium.

It is important to use solder compatible with both the PCB and the parts used. An example is ball grid array (BGA) using tin-lead solder balls for connections losing their balls on bare copper traces or using lead-free solder paste.

Other platings used are organic solderability preservative (OSP), immersion silver (IAg), immersion tin (ISn), electroless nickel immersion gold (ENIG) coating, electroless nickel electroless palladium immersion gold (ENEPIG), and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, are often nickel-plated then gold-plated using ENIG. Another coating consideration is rapid diffusion of coating metal into tin solder. Tin forms intermetallics such as Cu6Sn5 and Ag3Cu that dissolve into the Tin liquidus or solidus (at 50 °C), stripping surface coating or leaving voids.

Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias.whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence of halide and other ions, making it a poor choice for electronics use. Tin will grow "whiskers" due to tension in the plated surface. Tin-lead or solder plating also grows whiskers, only reduced by reducing the percentage of tin. Reflow to melt solder or tin plate to relieve surface stress lowers whisker incidence. Another coating issue is tin pest, the transformation of tin to a powdery allotrope at low temperature.

Areas that should not be soldered may be covered with solder resist (solder mask). The solder mask is what gives PCBs their characteristic green color, although it is also available in several other colors, such as red, blue, purple, yellow, black and white. One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask).

A legend (also known as silk or silkscreen) is often printed on one or both sides of the PCB. It contains the component designators, switch settings, test points and other indications helpful in assembling, testing, servicing, and sometimes using the circuit board.

Boards with no components installed are usually bare-board tested for "shorts" and "opens". This is called electrical test or PCB e-test. A short is a connection between two points that should not be connected. An open is a missing connection between points that should be connected. For high-volume production, a fixture such as a "bed of nails" in a rigid needle adapter makes contact with copper lands on the board. The fixture or adapter is a significant fixed cost and this method is only economical for high-volume or high-value production. For small or medium volume production instructs the electrical tester to apply a voltage to each contact point as required and to check that this voltage appears on the appropriate contact points and only on these.

In assembly the bare board is populated (or "stuffed") with electronic components to form a functional printed circuit assembly (PCA), sometimes called a "printed circuit board assembly" (PCBA).through-hole technology, the component leads are inserted in holes surrounded by conductive pads; the holes keep the components in place. In surface-mount technology (SMT), the component is placed on the PCB so that the pins line up with the conductive pads or lands on the surfaces of the PCB; solder paste, which was previously applied to the pads, holds the components in place temporarily; if surface-mount components are applied to both sides of the board, the bottom-side components are glued to the board. In both through hole and surface mount, the components are then soldered; once cooled and solidified, the solder holds the components in place permanently and electrically connects them to the board.

There are a variety of soldering techniques used to attach components to a PCB. High volume production is usually done with a pick-and-place machine and bulk wave soldering for through-hole parts or reflow ovens for SMT components and/or through-hole parts, but skilled technicians are able to hand-solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.)microscope, using tweezers and a fine-tip soldering iron, for small volume prototypes. Selective soldering may be used for delicate parts. Some SMT parts cannot be soldered by hand, such as BGA packages. All through-hole components can be hand soldered, making them favored for prototyping where size, weight, and the use of the exact components that would be used in high volume production are not concerns.

Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Or, even if all components are available in through-hole packages, it might be desired to take advantage of the size, weight, and cost reductions obtainable by using some available surface-mount devices. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress (such as connectors that are frequently mated and demated or that connect to cables expected to impart substantial stress to the PCB-and-connector interface), while components that are expected to go untouched will take up less space using surface-mount techniques. For further comparison, see the SMT page.

While the power is off, visual inspection, automated optical inspection. JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing.

To facilitate these tests, PCBs may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the board.

In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes, by using circuitry in the ICs to employ the IC pins themselves as test probes. JTAG tool vendors provide various types of stimuli and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins.

PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Another technique for applying a conformal coating is for plastic to be sputtered onto the PCB in a vacuum chamber. The chief disadvantage of conformal coatings is that servicing of the board is rendered extremely difficult.

Many assembled PCBs are static sensitive, and therefore they must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. The damage might not immediately affect function but might lead to early failure later on, cause intermittent operating faults, or cause a narrowing of the range of environmental and electrical conditions under which the board functions properly. Even bare boards are sometimes static sensitive: traces have become so fine that it is possible to blow a trace (or change its characteristics) with a static discharge. This is especially true on non-traditional PCBs such as MCMs and microwave PCBs.

Cordwood construction can save significant space and was often used with wire-ended components in applications where space was at a premium (such as fuzes, missile guidance, and telemetry systems) and in high-speed computers, where short traces were important. In cordwood construction, axial-leaded components were mounted between two parallel planes. The components were either soldered together with jumper wire or they were connected to other components by thin nickel ribbon welded at right angles onto the component leads.nickel-leaded components had to be used to allow reliable interconnecting welds to be made. Differential thermal expansion of the component could put pressure on the leads of the components and the PCB traces and cause mechanical damage (as was seen in several modules on the Apollo program). Additionally, components located in the interior are difficult to replace. Some versions of cordwood construction used soldered single-sided PCBs as the interconnection method (as pictured), allowing the use of normal-leaded components at the cost of being difficult to remove the boards or replace any component that is not at the edge.

Before the advent of integrated circuits, this method allowed the highest possible component packing density; because of this, it was used by a number of computer vendors including Control Data Corporation. The cordwood method of construction was used only rarely once PCBs became widespread, mainly in aerospace or other extremely high-density electronics.

A minimal PCB for a single component, used for prototyping, is called a breakout board. The purpose of a breakout board is to "break out" the leads of a component on separate terminals so that manual connections to them can be made easily. Breakout boards are especially used for surface-mount components or any components with fine lead pitch.

Advanced PCBs may contain components embedded in the substrate, such as capacitors and integrated circuits, to reduce the amount of space taken up by components on the surface of the PCB while improving electrical characteristics.

Multiwire is a patented technique of interconnection which uses machine-routed insulated wires embedded in a non-conducting matrix (often plastic resin).

Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in a straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other—which almost never happens in Multiwire), though the cost is too high to compete with cheaper PCB technologies when large quantities are needed.

Printed circuit boards have been used as an alternative to their typical use for electronic and biomedical engineering thanks to the versatility of their layers, especially the copper layer. PCB layers have been used to fabricate sensors, such as capacitive pressure sensors and accelerometers, actuators such as microvalves and microheaters, as well as platforms of sensors and actuators for Lab-on-a-chip (LoC), for example to perform polymerase chain reaction (PCR), and fuel cells, to name a few.

Manufacturers may not support component-level repair of printed circuit boards because of the relatively low cost to replace compared with the time and cost of troubleshooting to a component level. In board-level repair, the technician identifies the board (PCA) on which the fault resides and replaces it. This shift is economically efficient from a manufacturer"s point of view but is also materially wasteful, as a circuit board with hundreds of functional components may be discarded and replaced due to the failure of one minor and inexpensive part, such as a resistor or capacitor. This practice is a significant contributor to the problem of e-waste.

In many countries (including all European Single Market participants,United Kingdom,Turkey, and China), legislation restricts the use of lead, cadmium and mercury in electrical equipment. PCBs sold in such countries must therefore use lead-free manufacturing processes and lead-free solder, and attached components must themselves be compliant.

Safety Standard UL 796 covers component safety requirements for printed wiring boards for use as components in devices or appliances. Testing analyzes characteristics such as flammability, maximum operating temperature, electrical tracking, heat deflection, and direct support of live electrical parts.

US 2756485, Abramson, Moe & Danko, Stanislaus F., "Process of assembling electrical circuits", published 1956-07-31, assigned to Secretary of the United States Army

US patent 5434751, Cole, Jr., Herbert S.; Sitnik-Nieters, Theresa A. & Wojnarowski, Robert J. et al., "Reworkable high density interconnect structure incorporating a release layer", issued 18 July 1995

Buschow, K.H., ed. (2001). "Electronic Packaging:Solder Mounting Technologies". Encyclopedia of Materials: Science and Technology. Elsevier. pp. 2708–9. ISBN 0-08-043152-6.

"Production Methods and Materials 3.1 General". Printed Wiring Board Project Report – Table of Contents, Design for the Environment (DfE). Environmental Protection Agency.

Ayob, M.; Kendall, G. (2008). "A Survey of Surface Mount Device Placement Machine Optimisation: Machine Classification". European Journal of Operational Research. 186 (3): 893–914. CiteSeerX doi:10.1016/j.ejor.2007.03.042.

Wagner, G. Donald (1999). "History of Electronic Packaging at APL: From the VT Fuze to the NEAR Spacecraft" (PDF). Johns Hopkins APL Technical Digest. 20 (1). Archived from the original (PDF) on 2017-05-10. Retrieved 2016-12-19.

US 4175816, Burr, Robert P.; Morino, Ronald & Keogh, Raymo