s3c6410 arm11 lcd module free sample

Q. What tools do I need to work with WinCE? (S3C2416 / S3C6410) To change the runtime OS feature you will need the WinCE Platform Builder 5.0 (for WinCE5.0)/Visual Studio 2005 for WinCE6.0, as well as the BSP (board support package) that we provided in the shipped DVD. For application development you can use the EVC (Embedded Visual C++).

Q. I copied my EVC application to the board, but it disappeared as soon as I restarted the board. (S3C2416 / S3C6410) Be sure to copy it to the folder "Resident Flash".

Q. How can I change the MTD partition? (S3C2416 / S3C6410) MTD partition is defined in the file "arch/arm/plat-s3c/include/plat/partition.h", you may modify the partition information by modifying this file.

Q. Bootloader shows a lot of bad blocks in the Nand, is my NAND Flash broken? (S3C2416 / S3C6410) Normally such "bad blocks" are not real bad blocks. These blocks can be marked as bad blocks due to some faulty operations. Generally we can have this solved by running the "nand scrub" command in the uboot prompt, note that "nand scrub" will erase everything in your NAND, so please be sure to backup your data before doing this. Anyway, a few "real" bad blocks in the NAND Flash is normal and allowed and they would not effect anything.

Q. The touch screen go with big difference on linux QT. (S3C2416 / S3C6410) With this case please calibrate the touchscreen again according following steps.

Q. How to change the Linux boot logo? (S3C2416 / S3C6410) You need to prepare a logo image (png format), such as the name of linux_logo.png, please run under the linux. The settings are shown as the following directory.

Q. How to change the android boot animation? (S3C6410) Actually boot animation under the Android is formed by plenty of pictures take turns to play.

Q. How to configure the kernel support for different size of the LCD screen? (S3C2416 / S3C6410) Under the wince, users only need to choose according to their own LCD screen display resolution modify the macro definition of different screen in the file "bsp_cfg.h” under the directory “\SRC\INC”.

Under the linux QT, execute the command “make menuconfig”, then setting according to the following directory “Device Drivers --> Graphics support --> Support for frame buffer devices”, select the corresponding LCD screen LCD Type. Detailed methodology please refer to the corresponding user manual.

Under the android, if you are switching between resistive screen, you can modify the parameters of LCD in the bootargs under the uboot environment variable. If you are switching between the resistive and capacitive touch panel screen, you need to execute “make menuconfig” in the kernel, then setting according to the following directory “Device Drivers --> Input device support --> Touchscreens”, select the appropriate option to configure.

Q. How to configure the kernel support for different size of the LCD screen?Under the wince, users only need to choose according to their own LCD screen display resolution modify the macro definition of different screen in the file "bsp_cfg.h” under the directory “\SRC\INC”.

Under the linux QT, execute the command “make menuconfig”, then setting according to the following directory “Device Drivers --> Graphics support --> Support for frame buffer devices”, select the corresponding LCD screen LCD Type. Detailed methodology please refer to the corresponding user manual.

Under the android, if you are switching between resistive screen, you can modify the parameters of LCD in the bootargs under the uboot environment variable. If you are switching between the resistive and capacitive touch panel screen, you need to execute “make menuconfig” in the kernel, then setting according to the following directory “Device Drivers --> Input device support --> Touchscreens”, select the appropriate option to configure.

All of these, has made great convenience for the developers to evaluate and use, plus the 4.3 “LCD module which we customised according to the size of Mini6410, truly allows you to” All in one hand”!

OK6410-B ARM11 development board bundled with a 4.3" TFT LCD. Samsung S3C6410 MCU, 256MB DDR RAM, 2GB NAND Flash, WinCE / Linux / Android / uCos-II support, advanced Video / graphic support with 3D acceleration.

Founded in 2007, CoreWind is a leading supplier of system on modules (SOMs), development kits, and single board computers that enable customers to control costs, reduce risk, and speed time to market.

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The MINI6410S is a high performance ARM11 single board computer specially designed for consumer electronics, industrial control equipment. It features exactly the same dimensions and footprint as the popular MINI2440. and can therefore be used as a drop-in replacement for existing projects where more CPU power are needed.

As seen from Figure 1: the present invention includes: FPGA sampling mainboard, VLS (visual red laser light source) module, light power meter module, end face detection module, liquid crystal display screen display module, key-press module, ARM 11 embedded main boards and peripheral interface circuit; Sample mainboard, VLS module, light power meter module, end face detection module, liquid crystal display screen display module, button module, peripheral interface circuit of ARM 11 embedded main boards and FPGA is connected; Electric power management circuit provides power supply for above-mentioned each module.

ARM 11 embedded main boards are equipped with WINDOW CE6.0 operating system, complete man-machine exchange and data processing work, and FPGA sampling mainboard is responsible for the data acquisition of OTDR function, and the transfer of data that samples is processed to ARM11, and result is shown.The light power meter module is measured luminous power, and measurement result is transferred to ARM11, completes processing and the demonstration of data.Because ARM11 also is connected with VLS red light source module, control the operating state of its red light source.The end face detection module detects picture with end face and directly flows to ARM11, passes through LCD pictures.

VLS module, light power meter module, end face detection module, liquid crystal screen module, button module and ARM11 embedded main board that the present invention adopts are prior art products.

Be the embedded main board of core by ARM 11 (Samsung S3C6410); Embedded main board is used for completing man-machine exchange and data are processed.FPGA sampling mainboard is completed the high-speed sampling after light signal changes into the signal of telecommunication, and completes the control of laser and the auto-control of signal amplification circuit.

ARM11 communicates by letter with FPGA (Altera EP4CE6F17I8N), reads the data that FPGA samples, after ARM11 carries out corresponding computing by parameters with the data that read and result (result of calculation and curve) is presented on 7 cun liquid crystal display screens.ARM 11 also is connected with the light power meter module, and the luminous power parameter display that the light power meter module is measured is to liquid crystal display screen.ARM 11 also is connected with VLS (visual red laser module), can control the VLS module and send visible red, facilitates the user to measure.ARM 11 also is connected with the end face detector by USB, with the detection picture disply of end face detector to liquid crystal display screen.

Described FPGA is connected with the ARM11 embedded main board, receives the order that ARM11 sends, and does corresponding setting and measurement according to order; FPGA is connected with the DAC chip, controls the first via, the second tunnel and Third Road output of DAC chip, and the first via output of DAC chip is connected with laser control circuit, is used for controlling the transmitted power of 1310nm/1550nm pulsed laser; The second tunnel of DAC chip is connected with the first amplifier by the first operational amplifier, is used for controlling the first order common mode line of amplifying circuit; The Third Road of DAC chip is connected with the second amplifier by the second operational amplifier, is used for controlling the second level common mode line of amplifying circuit; FPGA also is connected with the 1310/1550nm drive circuit for laser by laser control circuit, is used for the pulse output of controlling organization device; FPGA also is connected with temperature sensor, is used for the real-time monitoring circuit plate temperature, and according to temperature, FPGA does corresponding adjustment to common mode line, makes common mode line be on best horizontal line; FPGA also is connected with high-frequency clock, guarantees the sequential of sampling, makes sampling more accurately quick; FPGA also is connected with ADC (analog-to-digital conversion) chip, is used for reading sampled signal; The APD photoelectric tube receives that the mode with the signal of telecommunication flows to first order amplifier after light signal, signal after amplifying is flowed to first order image current source circuit, the output signal of first order image current source circuit flows to second level amplifier, flow to second level image current source circuit after processing, the output signal of second level image current source circuit flows to third level amplifier, the defeated signal of third level amplifier is connected to differential amplifier, and differential amplifier changes into signal and is connected to the ADC chip after Difference signal pair and does the AD sampling.

Described FPGA also is connected with temperature sensor; be used for the Real-Time Monitoring built-in temperature; ARM 11 reads temperature value by FPGA; ARM11 is according to the temperature value of reading; test parameter is done corresponding adjustment, make test more accurate, ARM 11 1 can judge partial fault according to temperature value; and protect and send failure warning, automatic cut-off power when serious.

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Features Dimensions: 60 x 60 x 2.8 mm 8 layer. ARM11 Samsung S3C6410, ARM1176JZF-S, up to 667MHz 256MByte MoblieDDR, 266MHz 1GByte NAND Flash(support 8GByte NAND Flash) iNAND Flash interface (Can support 8GByte iNAND Flash) Audio I/O: WM9713 chips, Support two-channel Audio Output/Input, GSM call can be used with GSMmodule

100M Ethernet, DM9000 chips 170pin expansion interfacesQFP package The modular is led out most signals of ARM11 S3C6410, like Matrix Keypad, USB OTG, USB HOST, SDIO, LCD, Touch Screen, Camera, AC97, UART, SPI, I2C, ADC, DAC, PWM, EXT INT, GPIO and so on. Support Wince 6.0, Linux2.6 and Android 2.1 Power supply: 3.7V - 6.5V Temperature: 0 to +70 Celsius

General Description CORE6410 processor card is designed specially to be the heart of your next embedded design. The tiny board integrates Samsung S3C6410 processor ( ARM1176JZF-S, up to 800MHz). The processor card takes use of all common features of S3C6410 and the interface between the processor card and your carrierboard is through 170-pin expansion interfaces(QFP package). The Net and audio chip is integrated into the core board. The Audio, Net, USB, LCD, I/O and all other hardware interfaces are all expanded via these interfaces. Integration of the Eleckits Core6410 processor card to customer special design is fully supported by Eleckits technologies. Eleckits also designed an expansion board which can fully evaluate Core6410. The whole system is called Real6410. Eleckits offers Linux 2.6.28, WinCE6.0, Android2.1 BSP for this board. Customers can leverage our experience to increase your own productivity. The optimal embedded microprocessor solution provides users with a flexible development environment based on S3C6410 and a shortened development timeframe. Mother board

170-Pin Connector Eleckits Core6410 processor card is connected to carrierboard via 1.27mm space 170-pin QFP package. Pin Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 KP_COL3 KP_COL4 KP_COL5 KP_COL6 KP_COL7 EINT20 EINT21 PWR_ON/OFF GND CLK_32K SD0_CD SD0_D0 SD0_D1 SD0_C2 SD0_C3 SD0_CLK SD0_CMD XVD0 XVD1 XVD2 XVD3 XVD4 XVD5 XVD6 XVD7 XVD8 XVD9 XVD10 XVD11 XVD12 XVD13 XVD14 XVD15 XVD16 XVD17 XVD18 Function explanation Keypad column 3 Keypad column4 Keypad column5 Keypad column6 Keypad column7 External Interrupt 20 External Interrupt 21 Power enable high enable GND 32.768 clock output SDIO 0 Chip select, low enable SDIO 0 data bit 0 SDIO 0 data bit 1 SDIO 0 data bit 2 SDIO 0 data bit 3 SDIO 0 output clock SDIO 0 command signal LCD Pixel Data bit 0 LCD Pixel Data bit 1 LCD Pixel Data bit 2 LCD Pixel Data bit 3 LCD Pixel Data bit 4 LCD Pixel Data bit 5 LCD Pixel Data bit 6 LCD Pixel Data bit 7 LCD Pixel Data bit 8 LCD Pixel Data bit 9 LCD Pixel Data bit 10 LCD Pixel Data bit 11 LCD Pixel Data bit 12 LCD Pixel Data bit 13 LCD Pixel Data bit 14 LCD Pixel Data bit 15 LCD Pixel Data bit 16 LCD Pixel Data bit 17 LCD Pixel Data bit 18 Pull-up resistor 10k IO/ENT12 Pull-up resistor 10k IO Pull-up resistor 10k IO Pull-up resistor 10k IO Pull-up resistor 10k IO Pull-up resistor 10k IO Pull-up resistor 10k IO B0 B1 B2 B3 B4 B5 B6 B7 G0 G1 G2 G3 G4 G5 G6 G7 R0 R1 R2 IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO Notes other IO IO IO IO IO IO IO

LCD Pixel Data bit 19 LCD Pixel Data bit 20 LCD Pixel Data bit 21 LCD Pixel Data bit 22 LCD Pixel Data bit 23 LCD Horizontal Synchronization LCD Vertical Synchronization LCD DEN signal LCD Pixel Clock UART1 Clear To Send UART1 Receive data UART1 Request To Send UART1 Transmit data GND External Interrupt 0 External Interrupt 1 External Interrupt 2 External Interrupt 5 External Interrupt 6 External Interrupt 7 External Interrupt 10 External Interrupt 11 External Interrupt 13 External Interrupt 14 External Interrupt 15 External Interrupt 16 External Interrupt 17 External Interrupt 18 MIC input USB HOST D- pins USB HOST D+ pins PWM output 1 PWM output 0 MIC Differential input + MIC Differential input Audio left output Audio right output Audio output + Audio output MIC input +

Witech"s OK6410 is an ARM11 development kit that targets industrial control equipments, vehicle navigation devices, multi-media terminal and consumer electronic devices.

Witech again announced another upgrade on her best seller, the OK6410. Along with the powerful Samsung S3C6410 micro processor clocked to 667MHz,, the upgraded OK6410 carries now 256MB DDRram and 1GB NAND Flash, which provide more capacity to run Embedded Operating Systems and user applications. Most of the major Embedded Operating Systems are supported by the OK6410, such as Embedded Linux, WindowsCE, Android, VxWorks, uCos/II, Board Support Packages and sample programs are provided in source code for most of these mainstream Embedded OSes, including WindowsCE 6.0 R3, Linux-2.6.28, Android 2.1, to help users to simplify their development cycle.

The core module of the OK6410, named as OK6410-CORE, is actually an ARM11 SoM (System on Module), which is connected to the OK6410 carrier board by a 320p gilded anti-oxidative connector. Once programmed, the core module (SoM) can be detached from the carrier board and inserted like a “big chip” into users’ own est beds, prototypes, and production units for OEM deployment.